Polyamino-bis-imide resin

Abstract

A curable polyamino-bis-imide resin, obtained by the thermal reaction of: (A) a bis-imide represented by the general formula I: ##STR1## wherein R.sub.1 stands for a divalent organic group having a carbon-carbon double bond and R.sub.2 for a divalent aromatic organic group having 1 to 3 benzene rings, with (B) a diamine represented by the general formula II: ##STR2## wherein X stands for one member selected from the group consisting of O, S, SO.sub.2, CH.sub.2, CO, COO, C(CH.sub.3).sub.2, CF.sub.2 and C(CF.sub.3).sub.2, providing that the three X's may be identical or not identical to one another and the hydrogen atoms attached to the benzene rings may be substituted by an inactive alkyl group, perfluoroalkyl group or halogen atom, a solution thereof, cross-linked resins therefrom and laminated boards therefrom.

Dependencies are inferred from the claim text.