Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

A resin composition containing a maleimide compound (A) and a phosphorus-containing compound (B),

• the maleimide compound (A) including
• a first maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six, and
• a second maleimide compound (A2) having a maleimide group equivalent less than 400 g/eq, a content of the second maleimide compound (A2) with respect to the entire mass of the maleimide compound (A) being equal to or greater than 28.57% by mass and equal to or less than 65% by mass, and
• the phosphorus-containing compound (B) including a phosphorus-containing compound (B1) having a structure expressed by the following formula (b1):
• where s indicates an integer falling within a range from 1 to 10, Z indicates either an arylene group or an ester bond expressed by the following formula (b1.1), R1 to R3 each independently indicate either a hydrogen atom or a monovalent organic group, and * indicates a bond: