Heat-curable bismaleimide resin composition

Abstract

Provided is a resin composition capable of being turned into a cured product having a high glass-transition temperature and excellent dielectric properties as well. The resin composition is a heat-curable bismaleimide resin composition containing: (A) a bismaleimide compound represented by the following formula (1) wherein A independently represents a tetravalent organic group having 4 to 200 carbon atoms, B independently represents a divalent organic group having 2 to 200 carbon atoms, n is 2 to 100, and wherein A and/or B has therein a fluorene frame represented by the following formula (2) wherein each of R1, R2, R3 and R4 independently represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a (hetero)aryl group having 4 to 10 carbon atoms, a hydroxyl group, an alkoxy group, a halogeno group, an amino group, or a sulfenyl group; and (B) a reaction accelerator.

Dependencies are inferred from the claim text.