C08G 73/1025
Polymerised by radiations
Official title: {polymerised by radiations}
C08G73/1025 (Polymerised by radiations) appears on 125 US grants and 101 published applications in this corpus.
Search patents in C08G- Granted patents
- 125
- Published applications
- 101
- Assignees
- 77
- Inventors
- 341
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 5 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 7 | 0 |
| 2002 | 3 | 4 |
| 2003 | 1 | 6 |
| 2004 | 4 | 3 |
| 2005 | 0 | 1 |
| 2006 | 1 | 2 |
| 2007 | 2 | 2 |
| 2008 | 0 | 3 |
| 2009 | 1 | 3 |
| 2010 | 2 | 2 |
| 2011 | 2 | 1 |
| 2012 | 3 | 2 |
| 2013 | 1 | 1 |
| 2014 | 0 | 2 |
| 2015 | 1 | 0 |
| 2016 | 3 | 0 |
| 2017 | 0 | 3 |
| 2018 | 1 | 3 |
| 2019 | 3 | 2 |
| 2020 | 3 | 8 |
| 2021 | 3 | 4 |
| 2022 | 4 | 11 |
| 2023 | 9 | 10 |
| 2024 | 5 | 18 |
| 2025 | 7 | 6 |
| 2026 | 6 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- UV-curable resin compositions suitable for redistribution layers25 Aug 2026US 12,717,232 B2Designer Molecules, Inc.
- Photosensitive polyimide compositions9 Jun 2026US 12,650,646 B2Promerus, LLC
- Semiconductor device and method9 Jun 2026US 12,653,036 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Unsaturated cyclic anhydride end capped polyimides and polyamic acids and photosensitive compositions thereof2 Jun 2026US 12,643,981 B2Promerus, LLC
- Thermoplastic-thermoset hybrid resins, methods, and uses thereof26 May 2026US 12,637,543 B2Kaneka Corporation
- Photosensitive composition, transfer film, method for manufacturing laminate, laminate, and semiconductor package27 Aug 2026US 2026/0256003 A1FUJIFILM Corporation
- Polymer, negative photosensistive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic component11 Jun 2026US 2026/0161079 A1Shin-Etsu Chemical Co., Ltd.
- Photosensitive resin composition, photosensitive resin layer, and semiconductor device using the same5 Mar 2026US 2026/0062515 A1Samsung SDI.Co., Ltd.
- Resin composition, diamine compound, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor device1 Jan 2026US 2026/0003281 A1FUJIFILM Corporation
- Polyimide or polyimide precursor, resin composition, film14 Aug 2025US 2025/0257173 A1FUJIFILM Corporation
Most cited
By later US patents
- Patterned polyimide film, a photosensitive polyamide acid derivative and an electrophoretic image-display cell66US 4,741,988 AU. S. Philips Corporation · 1988
- Radiation-sensitive mixture and use thereof61US 5,087,550 ABASF SE · 1992
- Radiation-sensitive mixture and use thereof57US 5,284,734 ABASF SE · 1994
- Photosensitive compositions54US 4,243,743 AToray Industries, Inc. · 1981
- Base-soluble polyimide release layers for use in microlithographic processing53US 5,281,690 ABrewer Science Inc. · 1994