C04B 2237/40
Metallic
C04B2237/40 (Metallic) appears on 1,555 US grants and 1,293 published applications in this corpus.
Search patents in C04B- Granted patents
- 1,555
- Published applications
- 1,293
- Assignees
- 620
- Inventors
- 3,196
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 17 | 0 |
| 1977 | 9 | 0 |
| 1978 | 13 | 0 |
| 1979 | 8 | 0 |
| 1980 | 11 | 0 |
| 1981 | 8 | 0 |
| 1982 | 11 | 0 |
| 1983 | 9 | 0 |
| 1984 | 7 | 0 |
| 1985 | 18 | 0 |
| 1986 | 26 | 0 |
| 1987 | 28 | 0 |
| 1988 | 33 | 0 |
| 1989 | 36 | 0 |
| 1990 | 37 | 0 |
| 1991 | 43 | 0 |
| 1992 | 45 | 0 |
| 1993 | 25 | 0 |
| 1994 | 15 | 0 |
| 1995 | 19 | 0 |
| 1996 | 26 | 0 |
| 1997 | 13 | 0 |
| 1998 | 17 | 0 |
| 1999 | 32 | 0 |
| 2000 | 30 | 0 |
| 2001 | 32 | 14 |
| 2002 | 40 | 45 |
| 2003 | 54 | 71 |
| 2004 | 40 | 73 |
| 2005 | 45 | 53 |
| 2006 | 39 | 48 |
| 2007 | 44 | 36 |
| 2008 | 29 | 33 |
| 2009 | 23 | 44 |
| 2010 | 29 | 34 |
| 2011 | 26 | 28 |
| 2012 | 23 | 64 |
| 2013 | 31 | 45 |
| 2014 | 36 | 54 |
| 2015 | 41 | 61 |
| 2016 | 48 | 76 |
| 2017 | 46 | 58 |
| 2018 | 53 | 53 |
| 2019 | 50 | 58 |
| 2020 | 49 | 54 |
| 2021 | 41 | 53 |
| 2022 | 35 | 65 |
| 2023 | 43 | 61 |
| 2024 | 52 | 43 |
| 2025 | 40 | 45 |
| 2026 | 30 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate structures and methods of manufacture6 Oct 2026US 12,757,319 B2Semiconductor Components Industries, LLC
- Composite ceramic substrate having multi-layer configuration29 Sep 2026US 12,747,191 B2Tong Hsing Electronic Industries, Ltd.
- Metal-ceramic substrate, method for the production thereof, and module28 Jul 2026US 12,692,202 B2Heraeus Electronics GmbH & Co. KG
- Bonded substrate14 Jul 2026US 12,679,778 B2NGK Insulators, Ltd.
- Polycrystalline diamond and methods for fabricating the same14 Jul 2026US 12,680,395 B2US Synthetic Corporation
- Metal-ceramic substrate and process for producing a metal-ceramic substrate20 Aug 2026US 2026/0242289 A1
- Improved aluminum-containing nitride ceramic matrix composite, method of making, and method of use20 Aug 2026US 2026/0242660 A1SLT Technologies, Inc.
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248008 A1Heraeus Electronics GmbH & Co. KG
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248009 A1Heraeus Electronics GmbH & Co. KG
- Processing apparatuses and methods of using13 Aug 2026US 2026/0233495 A1QuantumScape Battery, Inc.
Most cited
By later US patents
- Compact of boron-doped diamond and method for making same385US 4,268,276 AGeneral Electric Company · 1981
- Polycrystalline diamond cutters with working surfaces having varied wear resistance while maintaining impact strength334US 6,601,662 B2Grant Prideco, L.P. · 2003
- Cutting element having composite formed of cemented carbide substrate and diamond layer and method of making same258US 4,784,023 ADiamant Boart-Stratabit (USA) Inc. · 1988
- Electrostatic chuck having gas cavity and method244US 6,310,755 B1APPLIED Materials.Inc. · 2001
- Tunable dielectric compositions including low loss glass184US 6,905,989 B2Paratek Microwave, Inc. · 2005