C04B 2237/404
Manganese or rhenium
C04B2237/404 (Manganese or rhenium) appears on 28 US grants and 24 published applications in this corpus.
Search patents in C04B- Granted patents
- 28
- Published applications
- 24
- Assignees
- 21
- Inventors
- 72
- Latest grant
- 9 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 0 | 2 |
| 2003 | 3 | 3 |
| 2004 | 1 | 0 |
| 2005 | 1 | 1 |
| 2006 | 2 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 0 | 2 |
| 2016 | 2 | 0 |
| 2017 | 0 | 2 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 1 | 0 |
| 2021 | 0 | 3 |
| 2022 | 3 | 2 |
| 2023 | 1 | 2 |
| 2024 | 2 | 1 |
| 2025 | 2 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such method9 Dec 2025US 12,495,491 B2Rogers Germany GmbH
- Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer18 Feb 2025US 12,226,856 B2Rogers Germany GmbH
- Ceramic structural body19 Nov 2024US 12,145,891 B2KYOCERA Corporation
- Method for producing a metal-ceramic substrate, solder system, and metal-ceramic substrate produced using such a method2 Apr 2024US 11,945,054 B2Rogers Germany GmbH
- Ceramic structure, electrostatic chuck and substrate fixing device23 May 2023US 11,658,015 B2Shinko Electric Industries Co., Ltd.
- Metal-ceramic substrate and process for producing a metal-ceramic substrate20 Aug 2026US 2026/0242289 A1
- Piezoelectric component22 May 2025US 2025/0169364 A1
- Method for structuring metal-ceramic substrates, and structured metal ceramic substrate29 Feb 2024US 2024/0074064 A1Heraeus Deutschland GmbH & Co. KG
- Process for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic Substrate Produced Using Such Method25 May 2023US 2023/0164913 A1Rogers Germany GmbH
- Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer2 Feb 2023US 2023/0031736 A1Rogers Germany GmbH
Most cited
By later US patents
- High hardness composite sintered compact29US 4,837,089 ANippon Oil and Fats Co., Ltd. · 1989
- Multilayer laminate heat sink assembly22US 5,583,317 ABrush Wellman Inc. · 1996
- Composite body made of graphite and high-melting metal20US 5,122,422 ASchwarzkopf Technologies Corporation · 1992
- Method of producing hybrid tubular metal/ceramic composites13US 7,153,465 B1Thor Technologies, Inc. · 2006
- Aluminum nitride sintered body, metal including member, electrostatic chuck, method of producing aluminum nitride sintered body, and method of producing metal including member12US 6,174,583 B1NGK Insulators, Ltd. · 2001