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US 12,226,856 B2Granted
Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer
AssigneeRogers Germany GmbH
InventorsStefan Britting, Tilo Welker, Karsten Schmidt
Life of this patent
Estimating the term…
Abstract
A solder material (30) for bonding a metal layer (20) to a ceramic layer (10), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising: a base material and an active metal, wherein the solder material (30) is a foil comprising the base material in a first layer (31) and the active metal in a second layer (32), and wherein the foil has a total thickness (GD) which is less than 50 μm, preferably less than 25 μm and particularly preferably less than 15 μm.
Claims13
A metal-ceramic substrate carrier for electrical components comprising:
- a ceramic layer (10),
- a metal layer (20), and
- a solder material (30) for bonding the metal layer (20) to the ceramic layer (10), the solder material (30) being arranged between the metal layer and the ceramic layer the solder material comprising:
- a base material and
- an active metal,
- wherein the solder material (30) is a foil having the base material in a first layer (31) and the active metal in a second layer (32), wherein the first layer (31) has a first thickness (D1), the second layer (32) has a second thickness (D2) and a third layer (33) has a third thickness (D3), wherein the second thickness (D2) is thinner than the first thickness (D1) and/or the third thickness (D3), and wherein a ratio of the second thickness (D2) to the first thickness (D1) has a value between 0.01 and 0.3, and wherein the foil has a total thickness (GD) which is less than 25 μm.
3 more elements
Dependencies are inferred from the claim text.