Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such method

A method for producing a metal-ceramic substrate (1) comprising:

• providing a ceramic element (10) and a metal sheet,
• providing a gas-tight container (25) enclosing the ceramic element (10),
• forming the metal-ceramic substrate (1) by bonding the metal sheet to the ceramic element (10) using hot isostatic pressing, wherein, for forming the metal-ceramic substrate (1), an active metal layer (15) is at least sectionally arranged between the metal sheet and the ceramic element (10) to promote metal sheet bonding to the ceramic element (10),
• wherein the active metal is titanium, zirconium, hafnium, chromium, niobium, cerium, tantalum, magnesium, lanthanum, vanadium, molybdenum, or tungsten, and
• wherein the metal sheet is structured to form a metal-ceramic substrate suitable as a printed circuit board, characterized in that the active metal layer (15) comprises only one active metal layer between the container and the ceramic element, and bonding is performed without the use of a solder material.