C04B 2237/407
Copper
C04B2237/407 (Copper) appears on 521 US grants and 484 published applications in this corpus.
Search patents in C04B- Granted patents
- 521
- Published applications
- 484
- Assignees
- 233
- Inventors
- 1,127
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 11 | 0 |
| 1990 | 5 | 0 |
| 1991 | 16 | 0 |
| 1992 | 13 | 0 |
| 1993 | 9 | 0 |
| 1994 | 9 | 0 |
| 1995 | 5 | 0 |
| 1996 | 11 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 12 | 0 |
| 2000 | 13 | 0 |
| 2001 | 8 | 5 |
| 2002 | 11 | 13 |
| 2003 | 13 | 24 |
| 2004 | 11 | 18 |
| 2005 | 14 | 14 |
| 2006 | 13 | 18 |
| 2007 | 14 | 10 |
| 2008 | 7 | 8 |
| 2009 | 7 | 13 |
| 2010 | 9 | 14 |
| 2011 | 8 | 6 |
| 2012 | 6 | 20 |
| 2013 | 14 | 10 |
| 2014 | 11 | 14 |
| 2015 | 8 | 16 |
| 2016 | 13 | 30 |
| 2017 | 18 | 20 |
| 2018 | 22 | 14 |
| 2019 | 20 | 18 |
| 2020 | 14 | 26 |
| 2021 | 19 | 25 |
| 2022 | 17 | 44 |
| 2023 | 20 | 40 |
| 2024 | 33 | 22 |
| 2025 | 25 | 28 |
| 2026 | 18 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate structures and methods of manufacture6 Oct 2026US 12,757,319 B2Semiconductor Components Industries, LLC
- Composite ceramic substrate having multi-layer configuration29 Sep 2026US 12,747,191 B2Tong Hsing Electronic Industries, Ltd.
- Metal-ceramic substrate, method for the production thereof, and module28 Jul 2026US 12,692,202 B2Heraeus Electronics GmbH & Co. KG
- Bonded substrate14 Jul 2026US 12,679,778 B2NGK Insulators, Ltd.
- Bonded body, ceramic-copper circuit board, and semiconductor device26 May 2026US 12,642,091 B2Niterra Materials Co., Ltd.
- Metal-ceramic substrate and process for producing a metal-ceramic substrate20 Aug 2026US 2026/0242289 A1
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248008 A1Heraeus Electronics GmbH & Co. KG
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248009 A1Heraeus Electronics GmbH & Co. KG
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method13 Aug 2026US 2026/0239541 A1
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
Most cited
By later US patents
- Multilayer coated abrasive element for bonding to a backing162US 5,049,164 ANorton Company · 1991
- Composite materials156US 4,055,451 A1977
- Direct bonding of metals to ceramics and metals132US 3,994,430 AGeneral Electric Company · 1976
- Methods for hermetically sealing ceramic to metallic surfaces and assemblies incorporating such seals130US 6,221,513 B1Pacific Coast Technologies, Inc. · 2001
- Polycrystal diamond tool84US 6,302,225 B1Sumitomo Electric Industries, Ltd. · 2001