C04B 2237/402
Aluminium
C04B2237/402 (Aluminium) appears on 304 US grants and 313 published applications in this corpus.
Search patents in C04B- Granted patents
- 304
- Published applications
- 313
- Assignees
- 158
- Inventors
- 668
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 6 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 8 | 0 |
| 2000 | 8 | 0 |
| 2001 | 5 | 3 |
| 2002 | 6 | 9 |
| 2003 | 10 | 9 |
| 2004 | 7 | 16 |
| 2005 | 6 | 8 |
| 2006 | 6 | 3 |
| 2007 | 3 | 6 |
| 2008 | 6 | 3 |
| 2009 | 3 | 5 |
| 2010 | 3 | 7 |
| 2011 | 4 | 8 |
| 2012 | 4 | 14 |
| 2013 | 3 | 11 |
| 2014 | 7 | 19 |
| 2015 | 12 | 18 |
| 2016 | 14 | 24 |
| 2017 | 19 | 21 |
| 2018 | 14 | 17 |
| 2019 | 14 | 6 |
| 2020 | 15 | 16 |
| 2021 | 13 | 15 |
| 2022 | 8 | 23 |
| 2023 | 12 | 16 |
| 2024 | 15 | 10 |
| 2025 | 16 | 17 |
| 2026 | 5 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Coating compositions26 May 2026US 12,637,538 B2PPG Industries Ohio, Inc.
- Methods of preparing metal sheets for a DCB / DAB substrate bonding process10 Feb 2026US 12,545,011 B2Littelfuse, Inc.
- Wafer placement table20 Jan 2026US 12,531,218 B2NGK Insulators, Ltd.
- Adapter element for connecting an electronics component to a heat sink element, system comprising an adapter element of this kind, and method for producing an adapter element of this kind20 Jan 2026US 12,531,390 B2Rogers Germany GmbH
- Method for manufacturing printed circuit board6 Jan 2026US 12,520,435 B2Fj Composite Materials Co., Ltd.
- Metal-ceramic substrate and process for producing a metal-ceramic substrate20 Aug 2026US 2026/0242289 A1
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method13 Aug 2026US 2026/0239541 A1
- Corrosion resistant power electronic modules30 Jul 2026US 2026/0223709 A1Rockwell Automation Technologies, Inc.
- Silicon nitride sintered body, silicon nitride substrate, silicon nitride circuit board, and semiconductor device16 Jul 2026US 2026/0200804 A1Niterra Materials Co., Ltd.
Most cited
By later US patents
- Functionally stepped, resistive ceramic163US 5,880,439 APhilip Morris Incorporated · 1999
- Composite materials156US 4,055,451 A1977
- Method of making reactive multilayer foil and resulting product95US 6,534,194 B2The Johns Hopkins University · 2003
- Ceramic-metal bonding67US 5,161,728 A1992
- Direct liquid phase bonding of ceramics to metals64US 4,602,731 ABorg-Warner Corporation · 1986