Method for manufacturing printed circuit board

A method of manufacturing a printed circuit board, the method comprising:

• forming (i) at least one upper deposition layer on an upper surface of each ceramic substrate included in a group of ceramic substrates and (ii) at least one lower deposition layer on a lower surface of each ceramic substrate included in the group of ceramic substrates, wherein the size of an area of the upper surface of each ceramic substrate and the size of an area of the lower surface of each ceramic substrate are the same;
• disposing the group of ceramic substrates side by side between a surface of an upper metal sheet and a surface of a lower metal sheet, wherein the size of an area of the surface of the upper metal sheet and the size of an area of the surface of the lower metal sheet are the same;
• and
• hot-pressing the upper and lower metal sheets to bond the upper and lower metal sheets and the group of ceramic substrates via said at least one upper deposition layer and said at least one lower deposition layer, wherein
• SB≥P×SA where SA is the size of the area of the upper surface of each ceramic substrate, SB is the size of the area of the surface of the upper metal sheet or the lower metal sheet, and 1.5≤P.