C04B 2237/366
Aluminium nitride
C04B2237/366 (Aluminium nitride) appears on 585 US grants and 629 published applications in this corpus.
Search patents in C04B- Granted patents
- 585
- Published applications
- 629
- Assignees
- 263
- Inventors
- 1,307
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 8 | 0 |
| 1990 | 2 | 0 |
| 1991 | 11 | 0 |
| 1992 | 12 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 9 | 0 |
| 1996 | 10 | 0 |
| 1997 | 5 | 0 |
| 1998 | 9 | 0 |
| 1999 | 19 | 0 |
| 2000 | 15 | 0 |
| 2001 | 22 | 5 |
| 2002 | 19 | 24 |
| 2003 | 15 | 14 |
| 2004 | 10 | 18 |
| 2005 | 7 | 9 |
| 2006 | 6 | 8 |
| 2007 | 8 | 10 |
| 2008 | 5 | 16 |
| 2009 | 4 | 14 |
| 2010 | 12 | 20 |
| 2011 | 7 | 10 |
| 2012 | 10 | 18 |
| 2013 | 14 | 27 |
| 2014 | 14 | 30 |
| 2015 | 22 | 31 |
| 2016 | 27 | 30 |
| 2017 | 22 | 39 |
| 2018 | 20 | 23 |
| 2019 | 25 | 35 |
| 2020 | 27 | 42 |
| 2021 | 22 | 40 |
| 2022 | 25 | 42 |
| 2023 | 31 | 46 |
| 2024 | 41 | 30 |
| 2025 | 32 | 30 |
| 2026 | 20 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composite ceramic substrate having multi-layer configuration29 Sep 2026US 12,747,191 B2Tong Hsing Electronic Industries, Ltd.
- Metal-ceramic substrate, method for the production thereof, and module28 Jul 2026US 12,692,202 B2Heraeus Electronics GmbH & Co. KG
- Bonded body, ceramic-copper circuit board, and semiconductor device26 May 2026US 12,642,091 B2Niterra Materials Co., Ltd.
- Ceramic plate19 May 2026US 12,635,466 B2NGK Insulators, Ltd.
- Device comprising a ceramic substrate and method for producing same19 May 2026US 12,635,519 B2Robert Bosch GmbH
- Improved aluminum-containing nitride ceramic matrix composite, method of making, and method of use20 Aug 2026US 2026/0242660 A1SLT Technologies, Inc.
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
- Copper-ceramic substrate with an upper face which can be sintered13 Aug 2026US 2026/0240018 A1Heraeus Electronics GmbH & Co. KG
Most cited
By later US patents
- Electrostatic chuck having gas cavity and method244US 6,310,755 B1APPLIED Materials.Inc. · 2001
- Scanning mammography system with improved skin line viewing146US 5,164,976 AGeneral Electric Company · 1992
- Methods for hermetically sealing ceramic to metallic surfaces and assemblies incorporating such seals130US 6,221,513 B1Pacific Coast Technologies, Inc. · 2001
- Abrasive bodies111US 4,522,633 A1985
- Polycrystal diamond tool84US 6,302,225 B1Sumitomo Electric Industries, Ltd. · 2001