Device comprising a ceramic substrate and method for producing same

A device, comprising:

• a ceramic substrate having a first side and a second side, wherein the first side is opposite the second side;
• a first brazing layer arranged on the first side in regions;
• a first copper layer is arranged on the first brazing layer;
• a second brazing layer arranged on the second side;
• and
• a second copper layer arranged on the second brazing layer;
• wherein the first copper layer has first trenches which extend from a surface of the first copper layer to the first side, the second copper layer has second trenches which extend from a surface of the second copper layer to at least one surface of the second brazing layer, wherein the second copper layer can be conductively connected to a heat sink;
• and
• wherein the first trenches have first trench bottoms and the second trenches have second trench bottoms, wherein the first trench bottoms are wider than the second trench bottoms;
• wherein the second trenches extend up to the surface of the second brazing layer;
• and
• wherein the first trench bottoms have a width of at least 0.5 mm.