B81C 3/007
Methods for aligning microparts not provided for in groups b81c3/004 - b81c3/005
Official title: {Methods for aligning microparts not provided for in groups B81C3/004 - B81C3/005}
B81C3/007 (Methods for aligning microparts not provided for in groups b81c3/004 - b81c3/005) appears on 4 US grants and 6 published applications in this corpus.
Search patents in B81C- Granted patents
- 4
- Published applications
- 6
- Assignees
- 4
- Inventors
- 11
- Latest grant
- 31 Jul 2018
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 0 | 1 |
| 2013 | 1 | 2 |
| 2014 | 0 | 0 |
| 2015 | 1 | 2 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 1 | 1 |
By publication year.
Recent patents
- Die bond design for medium pressure sensor31 Jul 2018US 10,035,703 B2Continental Automotive Systems, Inc.
- Micromechanical component and method for producing a micromechanical component12 Apr 2016US 9,309,111 B2Robert Bosch GmbH
- Disposable bond gap control structures7 Jul 2015US 9,073,298 B2Raytheon Company
- Disposable bond gap control structures4 Jun 2013US 8,454,789 B2Raytheon Company
- Manufacturing method for a micromechanical device including an oblique surface and corresponding micromechanical device13 Sep 2018US 2018/0257932 A1
- Micromechanical component and method for producing a micromechanical component14 May 2015US 2015/0131136 A1Robert Bosch GmbH
- Die bond design for medium pressure sensor2 Apr 2015US 2015/0091107 A1Continental Automotive Systems, Inc.
- Disposable bond gap control structures3 Oct 2013US 2013/0255876 A1Raytheon Company
- Method And System To Position Carbon Nanotubes Using AC Dielectrophoresis5 Sep 2013US 2013/0228364 A1The Trustees of Columbia University in the City of New York
Most cited
By later US patents