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US 8,454,789 B2Granted
Disposable bond gap control structures
AssigneeRaytheon Company
InventorsBuu Diep, Roland W. Gooch
Life of this patent
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Abstract
In certain embodiments, a bond gap control structure (BGCS) is placed outwardly from a substrate. The BGCS is configured to control a geometry of a bond line of a joining material. The joining material is deposited outwardly from the substrate. The substrate is bonded to another substrate with the joining material. The BGCS is at least partially removed from the substrate.
Claims2
A method comprising:
- jetting a bond gap control structure (BGCS) outwardly from a first substrate, the BGCS configured to control a geometry of a bond line of a joining material;
- disposing the joining material outwardly from the first substrate;
- bonding the first substrate to a second substrate with the joining material to yield a bonded structure;
- and
- sawing the BGCS from the bonded structure to completely remove the BGCS from the bonded structure.
2 more elements
Dependencies are inferred from the claim text.