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US 9,073,298 B2Granted
Disposable bond gap control structures
AssigneeRaytheon Company
InventorsBuu Diep, Roland Gooch
Life of this patent
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Abstract
In certain embodiments, a bond gap control structure (BGCS) is placed outwardly from a substrate. The BGCS is configured to control a geometry of a bond line of a joining material. The joining material is deposited outwardly from the substrate. The substrate is bonded to another substrate with the joining material. The BGCS is at least partially removed from the substrate.
Claims12
A method to join first and second substrates comprising:
- disposing a bond gap control structure (BGCS) outwardly from the first substrate;
- configuring the BGCS to provide uniformity in a bond line of a joining material;
- disposing the joining material outwardly from the first substrate and/or a second substrate;
- bonding the first substrate to the second substrate with the joining material to yield a bonded structure including a sealed area defined by the joining material and the first and second substrates, wherein the entire BGCS is external to the sealed area;
- and
- at least partially removing the BGCS from the bonded structure.
3 more elements
Dependencies are inferred from the claim text.