B81C 1/0069
Thermal properties
Official title: {Thermal properties, e.g. improve thermal insulation}
B81C1/0069 (Thermal properties) appears on 50 US grants and 55 published applications in this corpus.
Search patents in B81C- Granted patents
- 50
- Published applications
- 55
- Assignees
- 43
- Inventors
- 117
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 4 |
| 2007 | 1 | 2 |
| 2008 | 1 | 1 |
| 2009 | 1 | 0 |
| 2010 | 4 | 4 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 2 | 1 |
| 2014 | 4 | 1 |
| 2015 | 1 | 6 |
| 2016 | 3 | 3 |
| 2017 | 2 | 2 |
| 2018 | 4 | 2 |
| 2019 | 2 | 1 |
| 2020 | 3 | 3 |
| 2021 | 1 | 3 |
| 2022 | 3 | 2 |
| 2023 | 5 | 0 |
| 2024 | 3 | 5 |
| 2025 | 1 | 3 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Micro-electro mechanical system and manufacturing method thereof24 Feb 2026US 12,559,362 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Laterally-doped MEMS resonator with piezoelectric layer17 Feb 2026US 12,556,157 B1SiTime Corporation
- Process for manufacturing an optical microelectromechanical device having a tiltable structure with an antireflective surface3 Feb 2026US 12,540,070 B2STMicroelectronics S,r.l.
- MEMS and NEMS structures13 Jan 2026US 12,522,498 B2Obsidian Sensors, Inc.
- Non-lid-bonded MEMS resonator with phosphorus dopant14 Oct 2025US 12,445,107 B2SiTime Corporation
- Micro-electro mechanical system and manufacturing method thereof4 Jun 2026US 2026/0152385 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mems and nems structures23 Apr 2026US 2026/0109596 A1Obsidian Sensors, Inc.
- MEMS Sensor Module9 Apr 2026US 2026/0097955 A1Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- MEMS Resonator9 Apr 2026US 2026/0100692 A1SiTime Corporation
- Electronic Structure, Inertial Measurement Unit, Electronic Apparatus, And Moving Object12 Mar 2026US 2026/0070779 A1Seiko Epson Corporation
Most cited
By later US patents
- Method for temperature compensation in MEMS resonators with isolated regions of distinct material72US 7,639,104 B1Silicon Clocks, Inc. · 2009
- Thermal sensor/actuator in semiconductor material42US 5,830,372 ASiemens Aktiengesellschaft · 1998
- Thermal isolation microstructure40US 5,534,111 AHoneywell Inc. · 1996
- Thermal sensor/actuator in semiconductor material37US 5,596,219 ASiemens Aktiengesellschaft · 1997
- Method for manufacturing a thermal interface material25US 7,674,410 B2Hon Hai Precision Industry Co., Ltd. · 2010