B81B 1/004

Through-holes, i.e. extending from one face to the other face of the

Official title: {Through-holes, i.e. extending from one face to the other face of the wafer}

B81B1/004 (Through-holes, i.e. extending from one face to the other face of the) appears on 49 US grants and 63 published applications in this corpus.

Search patents in B81B
Granted patents
49
Published applications
63
Assignees
35
Inventors
119
Latest grant
7 Apr 2026

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B81B 1/004: granted patents and published applications per publication year
YearGranted patentsPublished applications
199110
199200
199300
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199500
199600
199710
199800
199920
200010
200100
200203
200301
200401
200531
200602
200730
200801
200901
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201100
201200
201300
201402
201526
201622
201724
201825
201944
202058
202154
202263
202314
202432
202546
202613

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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