Method for fabrication of high vertical aspect ratio thin film structures
AssigneeThe Regents of the University of California
InventorChristopher G. Keller
Life of this patent
Estimating the term…
Abstract
This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the fabrication of thin film structures in excess of 150 microns in height using thin film deposition processes. Wafers may be employed as reusable molds for efficient production of such structures.
Claims23
A method of fabrication of a micromechanical element, comprising:
- providing a mold having a depth;
- coating said mold with a sacrificial thin film layer;
- growing a structural thin film on said sacrificial thin film layer, without having first patterned said sacrificial thin film layer, so the thickness of said structural thin film is less than the depth of said mold;
- and
- etching said sacrificial thin film layer.
The method of claim 11 wherein said step of coating said mold with a sacrificial thin film layer is carried out by chemical vapor deposition.
A method of fabrication of a micromechanical element, comprising:
- providing a first substrate and anisotropically etching substantially vertical trenches in said first substrate to form a mold having a depth;
- coating said mold with a sacrificial thin film layer;
- forming a structural thin film having a thickness less than the depth of said mold on said sacrificial thin film layer;
- and
- etching said sacrificial thin film layer.
A method of fabrication of a micromechanical element comprising:
- providing a mold having a cavity of a given depth;
- coating said mold with a sacrificial thin film layer;
- growing a structural thin film on said sacrificial thin film layer so the thickness of said structural thin film is less than the depth of said cavity and without having first patterned said sacrificial thin film layer;
- etching said sacrificial thin film layer;
- and
- etching at least one passageway leading to said cavity from a back of said mold and connecting said at least one passageway to a source of pressure at said back of said mold.
Dependencies are inferred from the claim text.