Micro-device structures with etch holes
AssigneeX-Celeprint Limited
InventorsAntónio José Marques Trindade, Pierluigi Rubino
Life of this patent
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Abstract
A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.
Claims21
1-51. (canceled)
A micro-device structure, comprising:
- a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion;
- and
- micro-devices, wherein each of the micro-devices comprises a micro-device substrate separate and independent of any other micro-device substrate and each micro-device substrate is disposed completely and directly over the sacrificial portion;
- and
- a tether that separately and physically connects each micro-device to the anchor portion.
A micro-device system, comprising:
- a target substrate;
- one or more micro-devices, each micro-device comprising a micro-device substrate disposed on the target substrate, each micro-device substrate having a top side and an opposing bottom side and an etch hole that extends entirely through an interior portion of the micro-device substrate from the top side to the bottom side, and
- wherein each of the micro-devices comprises a micro-device substrate separate and independent of any other micro-device substrate.
An intermediate structure wafer, comprising:
- a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion;
- and
- an intermediate substrate disposed completely over the sacrificial portion, the intermediate substrate having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the intermediate substrate from the top side to the bottom side;
- one or more micro-devices disposed on the intermediate substrate, wherein the one or more micro-devices are non-native to the intermediate substrate;
- and
- a tether that physically connects the intermediate substrate to the anchor portion.
A micro-device structure, comprising:
- a source substrate having a sacrificial layer comprising one or more sacrificial portions adjacent to an anchor portion;
- micro-devices, each disposed completely over one of the one or more sacrificial portions;
- and
- a respective tether for each of the micro-devices, wherein each of the micro-devices is physically connected to the anchor portion by the respective tether,
- wherein (i) each of the micro-devices and the respective tether are rotated or reflected with respect to each other of the micro-device and the respective tether or (ii) the respective tether for each of the micro-devices physically connects the anchor portion directly to a different corner of the micro-device.
A method of making a micro-device structure, comprising:
- providing a source substrate comprising a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion;
- providing a micro-device comprising a micro-device substrate disposed completely and exclusively over the sacrificial portion, the micro-device substrate having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends entirely through an interior portion of the micro-device substrate from the top side to the bottom side, wherein the etch hole is in contact with the sacrificial portion and exposes a portion of the sacrificial portion, and a tether that physically connects the micro-device to the anchor portion;
- providing an etchant;
- and
- etching the sacrificial portion, wherein at least the exposed portion of the sacrificial portion is etched by the etchant passing through the etch hole, thereby forming a gap between the micro-device and the source substrate such that the micro-device is suspended from the anchor portion by the tether.
Dependencies are inferred from the claim text.