B24B 7/04
Involving a rotary work-table
Official title: involving a rotary work-table
B24B7/04 (Involving a rotary work-table) appears on 90 US grants and 145 published applications in this corpus.
Search patents in B24B- Granted patents
- 90
- Published applications
- 145
- Assignees
- 56
- Inventors
- 246
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 1 |
| 2003 | 0 | 2 |
| 2004 | 2 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 3 |
| 2007 | 1 | 2 |
| 2008 | 1 | 1 |
| 2009 | 2 | 1 |
| 2010 | 0 | 1 |
| 2011 | 0 | 2 |
| 2012 | 1 | 0 |
| 2013 | 1 | 1 |
| 2014 | 1 | 4 |
| 2015 | 1 | 3 |
| 2016 | 2 | 1 |
| 2017 | 2 | 6 |
| 2018 | 3 | 10 |
| 2019 | 6 | 7 |
| 2020 | 5 | 11 |
| 2021 | 3 | 8 |
| 2022 | 3 | 18 |
| 2023 | 5 | 19 |
| 2024 | 16 | 17 |
| 2025 | 12 | 15 |
| 2026 | 8 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Processing apparatus1 Sep 2026US 12,722,248 B2Disco Corporation
- Workpiece holding device18 Aug 2026US 12,708,981 B2Tokyo Seimitsu Co., Ltd.
- Method of grinding workpiece including two grinding steps23 Jun 2026US 12,661,756 B2Disco Corporation
- Polishing device for delayering16 Jun 2026US 12,654,281 B2Intec, Inc.
- Grinding apparatus26 May 2026US 12,636,753 B2Tokyo Electron Limited
- Grinding system and method of grinding semiconductor structure24 Sep 2026US 2026/0293577 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing apparatus and method for polishing a workpiece20 Aug 2026US 2026/0241509 A1Disco Corporation
- Grinding apparatus, inclination adjusting method, and information display20 Aug 2026US 2026/0241512 A1Tokyo Electron Limited
- Semiconductor wafer and semiconductor wafer processing method16 Jul 2026US 2026/0206513 A1Mitsubishi Electric Corporation
- Processing apparatus and method for manufacturing a wafer4 Jun 2026US 2026/0151873 A1Disco Corporation
Most cited
By later US patents
- Wafer grinder35US 4,318,250 ASt. Florian Company, Ltd. · 1982
- Method and apparatus for burnishing flexible recording material34US 3,943,666 ADysan Corporation · 1976
- Apparatus for polishing hard disk substrates30US 5,140,774 ASystem Seiko Co., Ltd. · 1992
- Chemical mechanical polishing method and apparatus26US 5,895,270 ATexas Instruments Incorporated · 1999
- Surface machining method and apparatus14US 5,791,976 ATokyo Seimitsu Co., Ltd. · 1998