Workpiece holding device
AssigneeTokyo Seimitsu Co., Ltd.
InventorTadashi Murasato
Life of this patent
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Abstract
A workpiece holding device capable of processing a workpiece with high accuracy. A holding section 3 in a processing apparatus 1 is a workpiece holding device that rotatably holds a workpiece W to be processed with a grinding stone 21, the workpiece holding device including a base 34, a chuck 33 that is composed of a material exhibiting a lower thermal expansion coefficient than that of the base 34, is placed on the base 34, and can adsorb and hold the workpiece W, and a clamping member 40 that is attached to the base 34 with gaps G1 and G2 between itself and the chuck 33 in a radial direction D of the base 34 and presses a flange 36a of the chuck 33 against the base 34.
Claims5
A workpiece holding device that rotatably holds a workpiece to be processed with a grinding stone, the workpiece holding device comprising:
- a base having a first matching element;
- a chuck that is placed on the base and can adsorb and hold the workpiece, the chuck having a frame with a second matching element, wherein the first and second matching elements match each other and fit together;
- and
- a clamping member that is attached to the base with a gap between the clamping member and the frame of the chuck in a radial direction of the base and presses a peripheral edge of the frame of the chuck against the base,
- the clamping member comprising:
- a main body section that is fastened to the base via a bolt,
- a rotation stopper protrusion that is offset from the bolt in the radial direction of the base and supported on the main body section, the rotation stopper protrusion is fitted in a recess in the frame of the chuck to restrict rotation in a circumferential direction of the chuck relative to the base, wherein the gap is formed on each opposing side of the rotation stopper protrusion in a radial direction.
Dependencies are inferred from the claim text.