Wafer grinder
AssigneeSt. Florian Company, Ltd.
InventorsHarold R. Klievoneit, Arthur A. Smith
Life of this patent
Estimating the term…
Abstract
A rotatable grinding wheel bears against a rotatable wafer disk support wheel to grind the wafer disks to a predetermined thickness. The grinding wheel is translatable laterally to its axis of rotation, which translation repositions the grinding wheel with respect to the support wheel in a fixed proportion to the lateral distance traveled and permits high tolerance grinding with relative coarse lateral positional adjustment of the grinding wheel.
Claims8
Apparatus for precisely regulating and controlling the depth to which work pieces are ground by a grinding wheel by relocating the grinding wheel in one direction which relocation results in only a fractual movement of the grinding wheel in another direction toward the work pieces, said apparatus comprising in combination:
- (a) a rotatable support wheel for supporting the work pieces in a plane perpendicular to the axis of rotation of said support wheel;
- (b) a rotatable grinding wheel for grinding the work pieces, said grinding wheel having a working surface in a plane parallel to the work piece supporting plane of said support wheel and rotating about an axis parallel with the axis of said support wheel;
- (c) means for repositioning said grinding wheel along a path fixed at an angle of other than 90.degree. to the axis of rotation of said grinding wheel to draw said grinding wheel across the face of said support wheel to grind the work pieces supported thereon and to simultaneously relocate said grinding wheel toward or away from the work pieces depending upon the direction of travel along the path traversed by said grinding wheel;
- whereby, the extent of movement of said grinding wheel toward or away from the work pieces is a function of the tangent of the path angle to provide a multiplied control and regulation grinding depth capability resolution.
A process for precisely regulating and controlling the depth to which work pieces are ground by a grinding wheel by relocating the grinding wheel in one direction which relocation results in only a fractional movement of the grinding wheel in another direction toward the work pieces, said process comprising the steps of:
- (a) supporting the work pieces upon a support wheel in a plane perpendicular to the axis of rotation of the support wheel;
- (b) grinding the work pieces with a grinding wheel rotating about an axis parallel to the axis of the support wheel, which grinding wheel has a working surface in a plane perpendicular to the work piece supporting plane of the support wheel;
- (c) repositioning the grinding wheel along a path fixed at an angle of other than 90.degree. to the axis of rotation of the grinding wheel to draw the grinding wheel across the face of the support wheel to grind the work pieces supported thereon and to simultaneously relocate the grinding wheel toward or away from the work pieces depending upon the direction of travel along the path traversed by the grinding wheel;
- whereby, the movement of the grinding wheel toward or away from the work pieces is a function of the tangent of the path angle to provide a multiplied control and regulation grinding depth resolution capability.
Dependencies are inferred from the claim text.