Grinding apparatus, inclination adjusting method, and information display
AssigneeTokyo Electron Limited
InventorsNobutaka FUKUNAGA, Masakazu YARIMITSU
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AssigneeTokyo Electron Limited
InventorsNobutaka FUKUNAGA, Masakazu YARIMITSU
Estimating the term…
A grinding apparatus configured to grind a substrate includes a substrate holder configured to hold the substrate on a holding surface thereof; a grinding device configured to grind the substrate, which is held by the substrate holder, with a grinding surface thereof; an inclination adjusting device configured to adjust a relative inclination between the holding surface and the grinding surface; and an information display configured to input and display information regarding shape correction of the substrate. The information display displays a display area in which an expected grinding shape of the substrate ground by the grinding device is displayed based on thickness information of the substrate before correction and correction pattern information.
A grinding apparatus configured to grind a substrate, comprising:
An inclination adjusting method of adjusting a relative inclination between a holding surface of a substrate holder and a grinding surface of a grinding device in a grinding apparatus,
An information display configured to display information regarding shape correction of a substrate, comprising:
Dependencies are inferred from the claim text.