B24B 37/32
Retaining rings
B24B37/32 (Retaining rings) appears on 554 US grants and 590 published applications in this corpus.
Search patents in B24B- Granted patents
- 554
- Published applications
- 590
- Assignees
- 165
- Inventors
- 944
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 7 | 0 |
| 1998 | 5 | 0 |
| 1999 | 13 | 0 |
| 2000 | 32 | 0 |
| 2001 | 39 | 18 |
| 2002 | 33 | 34 |
| 2003 | 37 | 22 |
| 2004 | 30 | 34 |
| 2005 | 36 | 25 |
| 2006 | 27 | 17 |
| 2007 | 12 | 22 |
| 2008 | 6 | 26 |
| 2009 | 10 | 14 |
| 2010 | 10 | 14 |
| 2011 | 15 | 8 |
| 2012 | 5 | 18 |
| 2013 | 13 | 18 |
| 2014 | 8 | 26 |
| 2015 | 14 | 23 |
| 2016 | 17 | 25 |
| 2017 | 18 | 18 |
| 2018 | 16 | 18 |
| 2019 | 19 | 30 |
| 2020 | 9 | 23 |
| 2021 | 9 | 24 |
| 2022 | 26 | 28 |
| 2023 | 34 | 29 |
| 2024 | 23 | 25 |
| 2025 | 12 | 24 |
| 2026 | 13 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Retainer ring, chemical mechanical polishing apparatus, and substrate polishing method29 Sep 2026US 12,746,638 B2Samsung Electronics Co., Ltd.
- Retaining ring for chemical-mechanical polishing22 Sep 2026US 12,745,596 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate suction member, elastic seal assembly, top ring, and substrate processing apparatus8 Sep 2026US 12,728,497 B2Ebara Corporation
- Polishing apparatus1 Sep 2026US 12,722,244 B2Ebara Corporation
- Retainer, top ring, and substrate processing apparatus4 Aug 2026US 12,697,699 B2Ebara Corporation
- Chemical mechanical polishing system and controlling method thereof1 Oct 2026US 2026/0295764 A1Korea University Research and Business Foundation, Sejong Campus
- Article for chemical mechanical polishing process and chemical mechanical polishing system including the article1 Oct 2026US 2026/0295772 A1Shpp Global Technologies B.V.
- Conductive polishing head fixing device and conductive polishing head system3 Sep 2026US 2026/0257314 A1Hangzhou Sizone Electronic Technology Inc.
- Substrate processing device and substrate processing method27 Aug 2026US 2026/0249419 A1Ebara Corporation
- Polishing pad, polishing method, and method for manufacturing semiconductor27 Aug 2026US 2026/0249420 A1Kuraray Co., Ltd.
Most cited
By later US patents
- Wafer polishing apparatus258US 5,584,751 AMitsubishi Materials Corporation · 1996
- Semiconductor wafer polishing apparatus with a flexible carrier plate167US 5,851,140 AIntegrated Process Equipment Corp. · 1998
- Pneumatic polishing head for CMP apparatus164US 5,643,061 AIntegrated Process Equipment Corp. · 1997
- Carrier head design for a chemical mechanical polishing apparatus162US 5,681,215 AAPPLIED Materials.Inc. · 1997
- Carrier head with a flexible membrane for a chemical mechanical polishing system159US 6,183,354 B2APPLIED Materials.Inc. · 2001