B24B 37/30
For single side lapping of plane surfaces
Official title: for single side lapping of plane surfaces
B24B37/30 (For single side lapping of plane surfaces) appears on 1,439 US grants and 1,324 published applications in this corpus.
Search patents in B24B- Granted patents
- 1,439
- Published applications
- 1,324
- Assignees
- 378
- Inventors
- 2,255
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 6 | 0 |
| 1994 | 3 | 0 |
| 1995 | 11 | 0 |
| 1996 | 9 | 0 |
| 1997 | 19 | 0 |
| 1998 | 27 | 0 |
| 1999 | 65 | 0 |
| 2000 | 95 | 0 |
| 2001 | 88 | 36 |
| 2002 | 90 | 83 |
| 2003 | 90 | 70 |
| 2004 | 75 | 79 |
| 2005 | 79 | 80 |
| 2006 | 82 | 52 |
| 2007 | 48 | 60 |
| 2008 | 24 | 50 |
| 2009 | 27 | 39 |
| 2010 | 22 | 31 |
| 2011 | 29 | 22 |
| 2012 | 21 | 44 |
| 2013 | 35 | 31 |
| 2014 | 27 | 55 |
| 2015 | 31 | 46 |
| 2016 | 34 | 44 |
| 2017 | 34 | 44 |
| 2018 | 32 | 39 |
| 2019 | 45 | 54 |
| 2020 | 24 | 48 |
| 2021 | 26 | 59 |
| 2022 | 53 | 56 |
| 2023 | 47 | 43 |
| 2024 | 46 | 64 |
| 2025 | 37 | 53 |
| 2026 | 22 | 42 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus and methods for chemical mechanical polishing29 Sep 2026US 12,746,636 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Retainer ring, chemical mechanical polishing apparatus, and substrate polishing method29 Sep 2026US 12,746,638 B2Samsung Electronics Co., Ltd.
- Retaining ring for chemical-mechanical polishing22 Sep 2026US 12,745,596 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate suction member, elastic seal assembly, top ring, and substrate processing apparatus8 Sep 2026US 12,728,497 B2Ebara Corporation
- Polishing apparatus1 Sep 2026US 12,722,244 B2Ebara Corporation
- Chemical mechanical polishing system and controlling method thereof1 Oct 2026US 2026/0295764 A1Korea University Research and Business Foundation, Sejong Campus
- Article for chemical mechanical polishing process and chemical mechanical polishing system including the article1 Oct 2026US 2026/0295772 A1Shpp Global Technologies B.V.
- Conductive polishing head fixing device and conductive polishing head system3 Sep 2026US 2026/0257314 A1Hangzhou Sizone Electronic Technology Inc.
- Substrate processing device and substrate processing method27 Aug 2026US 2026/0249419 A1Ebara Corporation
- Polishing pad, polishing method, and method for manufacturing semiconductor27 Aug 2026US 2026/0249420 A1Kuraray Co., Ltd.
Most cited
By later US patents
- Workpiece holder for polishing operation602US 4,512,113 A1985
- Continuous processing system for chemical mechanical polishing501US 5,738,574 AAPPLIED Materials.Inc. · 1998
- Transfer module for bowed wafers397US 9,355,882 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Wafer polisher head having floating retainer ring283US 5,205,082 ACybeq Systems, Inc. · 1993
- Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization282US 7,115,017 B1Novellus Systems, Inc. · 2006