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US 2026/0295772 A1Published application
Article for chemical mechanical polishing process and chemical mechanical polishing system including the article
AssigneeShpp Global Technologies B.V.
InventorsSoonyoung HYUN, Yanjie SUN, Haekwon KIM
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Abstract
An article for use in a chemical mechanical polishing process includes a metal backbone and a thermoplastic composition encapsulating the metal backbone. The metal backbone can optionally include a buffer layer between the surface of the backbone and the thermoplastic composition. The metal backbone or, when present, the buffer layer includes a plurality of pores. Methods for the manufacture of the article are also described.
Claims19
An article for use in a chemical mechanical polishing process comprising:
- a metal backbone optionally comprising a buffer layer on a surface of the metal backbone, wherein the metal backbone further comprises a plurality of pores on the surface of the metal backbone or, when present, on the buffer layer;
- and
- a thermoplastic composition encapsulating the metal backbone.
A polyphenylene sulfide composition comprising:
- 5 to 43.9 weight percent of a poly(etherimide-siloxane copolymer);
- 55 to 85 weight percent of a poly(phenylene sulfide);
- 1 to 10 weight percent of a polyaryl ether ketone;
- and
- 0.1 to 5 weight percent of an epoxy resin;
- and
- optionally, 0.1 to 10 weight percent of an additive composition;
- wherein weight percent is based on the total weight of the thermoplastic composition.
5 more elements
Dependencies are inferred from the claim text.