Wafer polisher head having floating retainer ring
AssigneeCybeq Systems, Inc.
InventorsNorm Shendon, Kenneth C. Struven, Robert J. Kolenkow
Life of this patent
Estimating the term…
Abstract
A polishing head for polishing a semiconductor wafer is described. The head design enables a wafer retainer to float during polishing and yet extend beyond a wafer carrier to define a pocket for the wafer and thereby facilitate wafer changing. The head construction also enables the carrier to be selectively projected beyond the retainer so that the surface of the carrier is easily accessible for changing an insert or the like. The head uses a positive air pressure to press the wafer against the polishing pad and the head includes interfering mechanical constructions which provide the positions mentioned above.
Claims21
A polishing head for positioning a semiconductor wafer for the polishing of a face thereof by a procedure which includes engagement of said face with a polishing surface, comprising:
- (a) a carrier for a wafer;
- (b) a retainer for resisting lateral force on a wafer caused by engagement of the face thereof with said polishing surface during the polishing of said face, which retainer engages said polishing surface with said wafer during the polishing of said face;
- and
- (c) a connector between said carrier and said retainer allowing the latter both to float on said surface while said wafer face is polished and to project beyond said carrier to form a pocket therewith for a wafer to facilitate application of the same to said carrier.
In a method of using an edge retainer on a semiconductor wafer carrier to define a pocket for a wafer to resist lateral forces which may be applied to such wafer during the treatment of a face thereof which includes engagement of said face with a treating surface, the steps of:
- (a) allowing said edge retainer to move during said engagement to accommodate angular variations between said wafer face and said treating surface;
- and
- (b) fixing the position of said edge retainer to define said wafer pocket at a time that said face is not in engagement with said treating surface.
A polishing head for positioning a semiconductor wafer for the polishing of a face thereof by a procedure which includes engagement of said face with a polishing surface, comprising:
- (a) means for carrying said water, said carrying means including an edge retainer to define a pocket for said wafer;
- (b) means for allowing said edge retainer to move during said engagement to accommodate angular variations between said wafer face and said polishing surface;
- and
- (c) means for fixing the position of said edge retainer to define said wafer pocket at a time that said face is not in engagement with said polishing surface.
A polishing head for positioning a disk-shaped semiconductor wafer for the polishing of a face thereof by a procedure which includes engagement of said face with the polishing surface of a polishing pad, comprising:
- (a) a carrier having a portion for holding a disk-shaped wafer with a face thereof to be polished exposed;
- (b) an annular retainer for circumscribing said portion, defining therewith a pocket for a disk-shaped wafer, and for resisting lateral force on a wafer in said pocket caused by engagement of said face with said polishing surface during the polishing of said face, which retainer engages said polishing surface with said wafer during the polishing of said face;
- (c) a flexible membrane connecting said carrier and said retainer positioned to respond to a pressure differential between two volumes on opposite sides of the same;
- (d) means for forming said pressure differential and cause said retainer to float on said polishing surface while said wafer face is being polished;
- and
- (e) interfering mechanical construction means to overcome said pressure differential and allow said retainer to project beyond said carrier to form a pocket therewith for a wafer.
Dependencies are inferred from the claim text.