Retainer, top ring, and substrate processing apparatus

Abstract

A retainer is disposed around a holding region 39 of a polygonal substrate WF in a top ring for holding the polygonal substrate WF with a surface to be polished facing downward. The retainer 30 includes a plurality of retainer main bodies 3 disposed around the holding region 39 independently along respective sides of the polygonal substrate WF. At least one of the plurality of retainer main bodies 3 includes a first securing surface (first surface 3a), a first opposed surface (second surface 3b), a second securing surface (third surface 3c), and a second opposed surface (fourth surface 3d). The first securing surface is securable to a retainer holding member 37 of the top ring, the first opposed surface is opposed to the holding region 39 in a first state where the first securing surface is secured to the retainer holding member 37, the second securing surface is securable to the retainer holding member 37 in a second state where the retainer main body 3 is rotated by 180 degrees from the first state, and the second opposed surface is opposed to the holding region 39 in a state where the second securing surface is secured to the retainer holding member 37.

Dependencies are inferred from the claim text.