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US 6,183,354 B2Granted
Carrier head with a flexible membrane for a chemical mechanical polishing system
AssigneeApplied Materials, Inc.
InventorsSteven M. Zuniga, Manoocher Birang, Hung Chen, Sen-Hou Ko
Life of this patent
Estimating the term…
Abstract
A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.
Claims92
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a retaining ring connected to the base;
- a support structure connected to the base by a flexure to be moveable independently of the base and the retaining ring;
- and
- a flexible membrane that defines a boundary of a pressurizable chamber, the membrane connected to the support structure and having a mounting surface for a substrate.
2 more elements
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a support structure connected to the base by a flexure;
- and
- a flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the support structure to define a boundary of a chamber that includes a first portion located above the support structure and a second portion located below the support structure.
1 more element
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a support structure connected to the base by a flexure, wherein an outer edge of the support structure includes a downwardly-projecting lip;
- and
- a flexible membrane that defines a boundary of a pressurizable chamber, the membrane connected to the support structure and extending beneath the support structure and around the lip and having a mounting surface for a substrate.
1 more element
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a support structure;
- a flexure connecting the base to the support structure;
- a flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the support structure to define, in conjunction with an inner surface of the base, an inner surface of the support structure and an inner surface of the flexure, a chamber;
- and
- the support structure, flexure and membrane configured such that a downward pressure on the flexure is substantially balanced by an upward pressure on the support structure so that a downward pressure on the substrate at the edge of the membrane is substantially the same as a downward pressure on the substrate at other portions of the membrane.
3 more elements
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a support structure;
- a flexure connecting the base to the support structure to permit relative vertical movement, there being a gap between the flexure and the support structure;
- a flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the support structure to define a boundary of a chamber;
- and
- a passage connected to the gap for introducing a fluid into the gap to force a slurry out of the gap.
3 more elements
A carrier head for positioning a substrate on a polishing surface, comprising:
- a housing connectable to a drive shaft to rotate therewith;
- a base;
- a gimbal mechanism pivotally connecting the housing to the base to permit the base to pivot with respect to the housing;
- a support structure movably connected to the base;
- a flexible membrane having a mounting surface for a substrate, the membrane connected to the support structure and extending beneath the base to define a boundary of a pressurizable chamber;
- and
- a retaining ring fixedly secured to the base to pivot with the base and surrounding the mounting surface.
4 more elements
A carrier head for positioning a substrate on a polishing surface, comprising:
- a housing connectable to a drive shaft to rotate therewith;
- a base;
- and
- a gimbal mechanism that connects the housing to the base to permit the base to pivot with respect to the housing about an axis substantially parallel to the polishing surface, the gimbal mechanism including
- a shaft having an upper end slidably disposed in a vertical passage in a vertical passage in the housing, and
- a flexible member that connects a lower end of the shaft to the base, wherein the flexible member bends to permit the base to pivot with respect to the housing.
3 more elements
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a first flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the base to define a boundary of a first chamber;
- and
- a second flexible membrane connected to the base and positioned above the first membrane to define a boundary of a second chamber, wherein a downward pressure on the first membrane exerted by the second membrane can be varied by forcing fluid into the second chamber.
1 more element
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a support structure movably connected to the base;
- a first membrane portion connected to the base and defining a boundary of a first substantially circular chamber;
- and
- a second membrane portion connected to the support structure wherein the second flexible membrane portion defines a boundary of a second substantially annular chamber which surrounds the first chamber.
2 more elements
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a support structure including a support plate having a recessed region therein, the support structure connected to the base by a flexure;
- and
- a flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the support structure to define a boundary of a chamber that includes a first volume between the base and the support plate and a second volume and the membrane, wherein the membrane is configured to be drawn into the recessed region if fluid is forced out of the chamber.
1 more element
A method of sensing the presence of a substrate in a carrier head, comprising the steps of:
- pressurizing a first chamber formed by a first flexible membrane having a mounting surface for the substrate;
- pressurizing a second chamber formed by a second flexible membrane to a first pressures;
- forcing fluid out of the first chamber to create a reduced pressure region to chuck the substrate to the mounting surface;
- and
- measuring a second pressure in the second chamber.
2 more elements
A method of chucking a substrate to a mounting surface of a carrier head, comprising the steps of:
- positioning a substrate against a mounting surface of a carrier head;
- forcing fluid into a first chamber having a boundary defined by a first flexible membrane to apply a downward pressure to an annular area of substrate;
- and
- forcing fluid out of a second chamber having a boundary defined by a second flexible membrane to draw the second membrane upwardly and create a reduced pressure region bounded by the annular area to chuck the substrate to the mounting surface.
1 more element
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a first flexible membrane portion connected to and extending beneath the base to form a first chamber;
- and
- a second flexible membrane portion connected to and extending beneath the base to form a second substantially annular chamber which surrounds the first chamber, wherein the first and second membrane portions provide a substrate receiving surface.
1 more element
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- and
- a flexible member connected to the base to form a first chamber and a second chamber, a lower surface of the flexible member providing a substrate receiving surface with a inner portion connected to the first chamber and a substantially annular outer portion surrounding the inner portion and connected to the second chamber.
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a support structure connected to the base by a flexure so as to be moveable independently of the base;
- and
- a flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the support structure to define a boundary of a pressurizable chamber, wherein a portion of the membrane along an edge of the mounting surface is vertically movable relative to the base.
1 more element
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a retaining ring secured to the base;
- a support structure connected to the base by a first flexible member so as to be moveable independently of the base;
- and
- a second flexible member having a mounting surface for a substrate, the second flexible member connected to and extending beneath the support structure to form a boundary of a pressurizable chamber, wherein the support structure and first flexible member are configured so that at least a portion of a downward force on the first flexible member caused by injection of fluid into the chamber is transferred to the retaining ring.
2 more elements
An apparatus for a chemical mechanical polishing system, comprising:
- a carrier head having a base and a flexible membrane coupled to the base to define a boundary of a first chamber, a lower surface of the flexible membrane providing a substrate receiving surface;
- a vacuum source connected to the chamber to evacuate fluid from the chamber;
- a pressure sensor to generate an output signal, wherein the carrier head is configured such that if the substrate is attached to the substrate receiving surface and the chamber is evacuated, the sensor measures a first pressure that is different from a second pressure that would result if the substrate were not attached to the substrate receiving surface;
- and
- a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.
2 more elements
A method of sensing the presence of a substrate in a carrier head, comprising the steps of:
- pressurizing a first chamber formed by a first flexible membrane having a mounting surface for the substrate;
- forcing fluid out of the first chamber to create a reduced pressure region to chuck the substrate to the mounting surface;
- and
- measuring a pressure associated with the carrier head to determine whether the substrate was successfully chucked to the mounting surface.
1 more element
A method of chucking a substrate to a mounting surface of a carrier head, comprising the steps of:
- positioning a substrate against a mounting surface of a carrier head that is provided by a lower surface of a first flexible membrane that defines a boundary of a first chamber;
- forcing fluid into a second chamber to apply a downward pressure to an upper surface of the first membrane in a first region;
- and
- forcing fluid out of the first chamber to create a second region of reduced pressure that is bounded by the first region to chuck the substrate to the mounting surface.
1 more element
A carrier head for chemical mechanical polishing, comprising:
- a base;
- a flexible membrane coupled to and extending below the base to form a first chamber having a first pressure, a lower surface of the flexible membrane providing a mounting surface for the substrate, wherein a first load applied to the substrate is controlled by the first pressure;
- a retaining ring coupled to the base;
- and
- a second chamber having a second pressure, the chamber located above the base to control a downward load on the base so that a second load applied to the retaining ring is increased by increasing the second pressure and decreased by increasing the first pressure.
2 more elements
A method of chemical mechanical polishing s substrate, comprising:
- holding a substrate with a carrier head having a substrate mounting surface and a retaining ring;
- selecting a first pressure for a first chamber in the carrier head, the load applied to the substrate being controlled by the first pressure;
- and
- selecting a second pressure for a second chamber in the carrier head, the load applied to the retaining ring being increased by increasing the second pressure and decreased by increasing the first pressure.
1 more element
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a housing connectable to a drive shaft to rotate therewith;
- a base located below the housing;
- a loading mechanism that connects the housing to the base to permit vertical movement of the base relative to the housing;
- and
- a cushion attached to a lower surface of the housing to limit upward movement of the base.
2 more elements
Dependencies are inferred from the claim text.