B23K 35/264
Bi as the principal constituent
Official title: {Bi as the principal constituent}
B23K35/264 (Bi as the principal constituent) appears on 162 US grants and 227 published applications in this corpus.
Search patents in B23K- Granted patents
- 162
- Published applications
- 227
- Assignees
- 128
- Inventors
- 522
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 1 |
| 2002 | 1 | 3 |
| 2003 | 6 | 3 |
| 2004 | 1 | 5 |
| 2005 | 2 | 4 |
| 2006 | 1 | 6 |
| 2007 | 3 | 8 |
| 2008 | 2 | 2 |
| 2009 | 4 | 11 |
| 2010 | 3 | 9 |
| 2011 | 1 | 8 |
| 2012 | 7 | 6 |
| 2013 | 3 | 10 |
| 2014 | 4 | 15 |
| 2015 | 11 | 16 |
| 2016 | 9 | 15 |
| 2017 | 10 | 22 |
| 2018 | 12 | 12 |
| 2019 | 12 | 8 |
| 2020 | 6 | 9 |
| 2021 | 6 | 13 |
| 2022 | 5 | 9 |
| 2023 | 13 | 10 |
| 2024 | 6 | 12 |
| 2025 | 6 | 6 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint26 May 2026US 12,636,738 B2Senju Metal Industry Co., Ltd.
- Solder alloy, joint portion, joining material, solder paste, joint structure, and electronic control device10 Mar 2026US 12,569,940 B2Tamura Corporation
- Stable undercooled metallic particles for filling a void24 Feb 2026US 12,559,824 B2Iowa State University Research Foundation, Inc.
- Flux and solder paste10 Feb 2026US 12,544,862 B2Senju Metal Industry Co., Ltd.
- Solder material and method for die attachment12 Aug 2025US 12,388,042 B2Alpha Assembly Solutions Inc.
- Solder Alloy, Solder Paste, Solder Ball, and Solder Joint25 Jun 2026US 2026/0175332 A1Senju Metal Industry Co., Ltd.
- Metal-cored wire electrode for high deposition rate welding processes7 May 2026US 2026/0124695 A1Hobart Brothers Company
- Flux and solder paste23 Apr 2026US 2026/0108989 A1Senju Metal Industry Co., Ltd.
- Solder Supply Method1 Jan 2026US 2026/0001173 A1Senju Metal Industry Co., Ltd.
- High impact solder toughness alloy11 Dec 2025US 2025/0375841 A1Alpha Assembly Solutions Inc.
Most cited
By later US patents
- Tin-bismuth solder connection having improved high temperature properties, and process for forming same70US 5,320,272 AMotorola, Inc. · 1994
- Electrodeposited eutectic tin-bismuth alloy on a conductive substrate63US 5,039,576 AAtochem North America, Inc. · 1991
- Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies46US 5,522,535 ATosoh SMD, Inc. · 1996
- System and method for hermetic seal formation46US 7,168,608 B2Avago Technologies General IP (Singapore) Pte. Ltd. · 2007
- Article comprising solder with improved mechanical properties40US 5,346,775 AAT&T Laboratories · 1994