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US 2025/0375841 A1Published application
High impact solder toughness alloy
AssigneeAlpha Assembly Solutions Inc.
InventorsRanjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
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Abstract
A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0.05 to 0.4 wt % Cu; from 0 to 0.5 wt % Co; and the balance Sn, together with any unavoidable impurities.
Claims28
A lead-free solder alloy, comprising:
- from 35 to 59 wt % Bi;
- from 0.9 to 1.0 wt % Ag;
- from 0.1 to 1.0 wt % Cu;
- from 0.01 to 0.07 wt % Co;
- and the balance Sn, together with any unavoidable impurities;
- wherein the alloy begins to melt at approximately 138° C.
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Dependencies are inferred from the claim text.