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US 7,168,608 B2Granted
System and method for hermetic seal formation
AssigneeAvago Technologies General IP (Singapore) Pte. Ltd.
InventorZequn Mei
Life of this patent
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Abstract
System and method for formation of a hermetic seal with an significantly greater melting temperature than the melting temperature of the solder employed. The hermetic seal is formed from a solder with a low melting point and a metal having a predetermined thickness that corresponds to the solder. The solder and metal combination undergoes reflow for a period of time relative to the solder thickness. The resultant seal has a melting point at a temperature significantly greater than the melting temperature of the solder.
Claims18
A hermetic seal comprising:
- a solder having a melting point at a first temperature;
- a metal having a predetermined thickness that corresponds to the solder;
- whereby the combination of the solder and metal undergoes reflow to form said hermetic seal;
- and
- whereby said hermetic seal has a melting point at a second temperature, wherein the second temperature is at least 50% greater than the first temperature.
2 more elements
Dependencies are inferred from the claim text.