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US 12,388,042 B2Granted
Solder material and method for die attachment
AssigneeAlpha Assembly Solutions Inc.
InventorsAngelo Gulino, Bogdan Bankiewicz, Oscar Khaselev, Anna Lifton, Michael T. Marczi, Girard Sidone, Paul Salerno, Paul J. Koep
Life of this patent
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Abstract
A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
Claims15
A solder material comprising:
- a solder, and
- a thermal conductivity modifying component, the thermal conductivity modifying component being in the form of a wire,
- wherein:
- the solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K,
- the solder material is in the form of a solder preform,
- the solder comprises tin,
- the thermal conductivity modifying component comprises tin plated copper, and
- the solder material comprises between about 40 wt. % and about 90 wt. % of the solder and about 60 wt. % to about 10 wt. % of the thermal conductivity modifying component.
5 more elements
Dependencies are inferred from the claim text.