B23K 35/26
With the principal constituent melting at less than 400°c
Official title: with the principal constituent melting at less than 400°C
B23K35/26 (With the principal constituent melting at less than 400°c) appears on 1,346 US grants and 1,556 published applications in this corpus.
Search patents in B23K- Granted patents
- 1,346
- Published applications
- 1,556
- Assignees
- 651
- Inventors
- 3,075
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 5 | 0 |
| 1978 | 4 | 0 |
| 1979 | 5 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 5 | 0 |
| 1985 | 4 | 0 |
| 1986 | 5 | 0 |
| 1987 | 9 | 0 |
| 1988 | 5 | 0 |
| 1989 | 10 | 0 |
| 1990 | 11 | 0 |
| 1991 | 11 | 0 |
| 1992 | 18 | 0 |
| 1993 | 7 | 0 |
| 1994 | 14 | 0 |
| 1995 | 21 | 0 |
| 1996 | 17 | 0 |
| 1997 | 19 | 0 |
| 1998 | 22 | 0 |
| 1999 | 22 | 0 |
| 2000 | 24 | 0 |
| 2001 | 40 | 13 |
| 2002 | 37 | 48 |
| 2003 | 36 | 55 |
| 2004 | 36 | 66 |
| 2005 | 32 | 59 |
| 2006 | 23 | 48 |
| 2007 | 31 | 61 |
| 2008 | 14 | 36 |
| 2009 | 31 | 56 |
| 2010 | 31 | 47 |
| 2011 | 23 | 58 |
| 2012 | 29 | 45 |
| 2013 | 36 | 54 |
| 2014 | 37 | 75 |
| 2015 | 47 | 85 |
| 2016 | 52 | 99 |
| 2017 | 70 | 104 |
| 2018 | 62 | 85 |
| 2019 | 86 | 66 |
| 2020 | 53 | 63 |
| 2021 | 52 | 69 |
| 2022 | 42 | 76 |
| 2023 | 69 | 69 |
| 2024 | 45 | 52 |
| 2025 | 44 | 46 |
| 2026 | 32 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Solder and electronic component22 Sep 2026US 12,741,343 B2TDK Corporation
- Brazing paste15 Sep 2026US 12,734,617 B2Senju Metal Industry Co., Ltd.
- Semiconductor device including semiconductor element and lead-free solder bonding material and method for manufacturing the same25 Aug 2026US 12,721,207 B2Hitachi Power Semiconductor Device, Ltd.
- Passive quench protection techniques for non-insulated superconducting magnets4 Aug 2026US 12,700,530 B2Commonwealth Fusion Systems LLC
- Bumps comprising tin, cooper and bismuth for liquid metal socket interconnects4 Aug 2026US 12,702,042 B2Intel Corporation
- Flux, solder paste, and method for producing joined structure3 Sep 2026US 2026/0257305 A1Koki Company Limited
- Solder paste20 Aug 2026US 2026/0241494 A1Heraeus Materials Technology Shanghai Ltd.
- Diffusion soldering method and solder material20 Aug 2026US 2026/0241495 A1Infineon Technologies AG
- Substrate having fine through-holes filled with metal and manufacturing method thereof13 Aug 2026US 2026/0233345 A1Tanigurogumi Corporation
- Solder ball13 Aug 2026US 2026/0233346 A1Nippon Micrometal Corporation
Most cited
By later US patents
- Selective laser sintering of parts by compound formation of precursor powders280US 5,156,697 ABoard of Regents, The University of Texas System · 1992
- Composite solder paste for flip chip bumping102US 5,803,340 ADelco Electronics Corporation · 1998
- Composite bearing structure of alternating hard and soft metal, and process for making the same92US 4,474,861 ASmith International, Inc. · 1984
- Method and apparatus for forming solder balls and solder columns91US 5,542,174 AIntel Corporation · 1996
- Direct solder bumping of hard to solder substrate91US 6,015,083 AMicroFab Technologies, Inc. · 2000