B23K 35/262
Sn as the principal constituent
Official title: {Sn as the principal constituent}
B23K35/262 (Sn as the principal constituent) appears on 1,063 US grants and 1,302 published applications in this corpus.
Search patents in B23K- Granted patents
- 1,063
- Published applications
- 1,302
- Assignees
- 537
- Inventors
- 2,505
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 7 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 5 | 0 |
| 1992 | 11 | 0 |
| 1993 | 4 | 0 |
| 1994 | 12 | 0 |
| 1995 | 17 | 0 |
| 1996 | 11 | 0 |
| 1997 | 10 | 0 |
| 1998 | 13 | 0 |
| 1999 | 14 | 0 |
| 2000 | 15 | 0 |
| 2001 | 32 | 12 |
| 2002 | 32 | 41 |
| 2003 | 30 | 50 |
| 2004 | 32 | 54 |
| 2005 | 29 | 48 |
| 2006 | 18 | 38 |
| 2007 | 26 | 50 |
| 2008 | 9 | 31 |
| 2009 | 25 | 47 |
| 2010 | 27 | 39 |
| 2011 | 20 | 54 |
| 2012 | 22 | 33 |
| 2013 | 28 | 46 |
| 2014 | 31 | 61 |
| 2015 | 38 | 72 |
| 2016 | 46 | 88 |
| 2017 | 58 | 86 |
| 2018 | 50 | 74 |
| 2019 | 76 | 55 |
| 2020 | 44 | 45 |
| 2021 | 41 | 54 |
| 2022 | 36 | 66 |
| 2023 | 53 | 55 |
| 2024 | 41 | 46 |
| 2025 | 38 | 38 |
| 2026 | 24 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solder and electronic component22 Sep 2026US 12,741,343 B2TDK Corporation
- Brazing paste15 Sep 2026US 12,734,617 B2Senju Metal Industry Co., Ltd.
- Semiconductor device including semiconductor element and lead-free solder bonding material and method for manufacturing the same25 Aug 2026US 12,721,207 B2Hitachi Power Semiconductor Device, Ltd.
- Passive quench protection techniques for non-insulated superconducting magnets4 Aug 2026US 12,700,530 B2Commonwealth Fusion Systems LLC
- Solder particle manufacturing method, solder particle, and conductive composition28 Jul 2026US 12,691,533 B2Dexerials Corporation
- Flux, solder paste, and method for producing joined structure3 Sep 2026US 2026/0257305 A1Koki Company Limited
- Solder paste20 Aug 2026US 2026/0241494 A1Heraeus Materials Technology Shanghai Ltd.
- Diffusion soldering method and solder material20 Aug 2026US 2026/0241495 A1Infineon Technologies AG
- Substrate having fine through-holes filled with metal and manufacturing method thereof13 Aug 2026US 2026/0233345 A1Tanigurogumi Corporation
- Solder ball13 Aug 2026US 2026/0233346 A1Nippon Micrometal Corporation
Most cited
By later US patents
- Selective laser sintering of parts by compound formation of precursor powders280US 5,156,697 ABoard of Regents, The University of Texas System · 1992
- Direct solder bumping of hard to solder substrate91US 6,015,083 AMicroFab Technologies, Inc. · 2000
- Tin base lead-free solder composition containing bismuth, silver and antimony73US 4,806,309 AWillard Industries, Inc. · 1989
- Solder hierarchy for chip attachment to substrates66US 5,729,440 AInternational Business Machines Corporation · 1998
- Pb-free, tin base solder composition64US 4,758,407 AJ.W. Harris Co., Inc. · 1988