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US 12,691,533 B2Granted
Solder particle manufacturing method, solder particle, and conductive composition
AssigneeDexerials Corporation
InventorsSarii Yamaguchi, Hidetsugu Namiki, Takeshi Nishio
Life of this patent
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Abstract
A solder particle manufacturing method includes a curing step of curing solder particles such that a hardness K of the solder particles under compressive deformation to 70% is 850 N/mm2 or greater and 1,500 N/mm2 or less, and a classifying step of classifying the solder particles after being cured by forcibly generating an airflow using a classifying device.
Claims5
A solder particle manufacturing method, comprising:
- curing solder particles such that a hardness K of the solder particles under compressive deformation to 70% is 850 N/mm2 or greater and 1,500 N/mm2 or less;
- and
- classifying the solder particles after being cured by forcibly generating an airflow using a classifying device.
Dependencies are inferred from the claim text.