Back to results
US 12,741,343 B2Granted
Solder and electronic component
AssigneeTDK Corporation
InventorsToshihiro Iguchi, Norihisa Ando
Life of this patent
Estimating the term…
Abstract
A solder includes a Sn alloy phase and a particle. The particle has a higher Young's modulus than the Sn alloy phase. The particle has a lower linear expansion coefficient than the Sn alloy phase. An electronic component includes a metal terminal joined thereto with the solder.
Claims8
A solder comprising:
- a Sn alloy phase;
- and
- particles, wherein the particles have a higher Young's modulus than the Sn alloy phase;
- the particles have a lower linear expansion coefficient than the Sn alloy phase;
- the particles comprise SiC, AlN, Al2O3, and/or BaTiO3 as a main component,
- the particles occupy 15 vol % or more and 35 vol % or less;
- and
- an average size of the particles is 3 μm or more and 20 μm or less.
5 more elements
Dependencies are inferred from the claim text.