B23K 35/266
Cd as the principal constituent
Official title: {Cd as the principal constituent}
B23K35/266 (Cd as the principal constituent) appears on 9 US grants and 7 published applications in this corpus.
Search patents in B23K- Granted patents
- 9
- Published applications
- 7
- Assignees
- 11
- Inventors
- 21
- Latest grant
- 19 Sep 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 2 |
| 2020 | 0 | 0 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
| 2023 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Diffusion soldering preform with varying surface profile19 Sep 2023US 11,764,185 B2Infineon Technologies Austria AG
- Alternative compositions for high temperature soldering applications13 Sep 2022US 11,440,142 B2Ormet Circuits, Inc.
- Use of an alloy as a brazing alloy for an electric switch braze joint, an electric switch braze joint, an electric switch and a method of producing an electric switch braze joint6 Jul 2021US 11,052,492 B2ABB Schweiz AG
- Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same18 Jul 2017US 9,707,642 B2Baker Hughes Incorporated
- Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium5 Oct 2010US 7,806,994 B2S-Bond Technologies, LLC
- Diffusion soldering preform with varying surface profile2 Mar 2023US 2023/0065738 A1Infineon Technologies Austria AG
- Filler additives to avoid weld cracking10 Oct 2019US 2019/0308280 A1Siemens Energy, Inc.
- Use of an alloy as a brazing alloy for an electric switch braze joint, an electric switch braze joint, an electric switch and a method of producing an electric switch braze joint9 May 2019US 2019/0134760 A1ABB Schweiz AG
- Alternative compositions for high temperature soldering applications22 Dec 2016US 2016/0368103 A1Ormet Circuitd, Inc.
- Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same12 Jun 2014US 2014/0158255 A1Baker Hughes Incorporated
Most cited
By later US patents
- Semiconductor production apparatus13US 4,964,969 AMitsubishi Denki Kabushiki Kaisha · 1990
- Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium12US 7,806,994 B2S-Bond Technologies, LLC · 2010
- Solder composition of mixed powders11US 4,834,794 ATDK Corporation · 1989
- Solder alloys for soldering difficultly solderable material10US 4,106,930 AAsahi Glass Company, Limited · 1978
- Alloy for soldering aluminum2US 4,173,468 A1979