Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same

A solder composition comprising:

• a metal or a metal alloy;
• and
• an electrically conductive high temperature polymeric composition;
• where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal;
• and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy;
• where the metal or metal alloy forms a matrix of the solder composition;
• where the electrically conductive high temperature polymeric composition comprises a high temperature polymer and an electrically conducting filler;
• where the high temperature polymer has a glass transition temperature or a melting point that is greater than or equal to 175° C.;
• where the high temperature polymer comprises polyether sulfone, polyetherether ketone, polyaryletherketones, polyphenylene sulfone ureas, polybenzoxazoles, polyoxadiazoles, polybenzothiazinophenothiazines, polybenzothiazoles, polypyrazinoquinoxalines, polypyromellitimides, polyquinoxalines, polybenzimidazoles, polyoxindoles, polyoxoisoindolines, polydioxoisoindolines, polytriazines, polypyridazines, polypiperazines, polypyridines, polypiperidines, polytriazoles, polypyrazoles, polypyrrolidines, polycarboranes, polyoxabicyclononanes, polydibenzofurans, or a combination comprising at least one of the foregoing polymers.