Alloy for soldering aluminum
OwnerFrank M. Gaultinventor
Life of this patent
Estimating the term…
Abstract
An improved alloy especially suitable for soldering aluminum to aluminum or aluminum to other metals which has a base containing bismuth, lead and/or cadmium to which is added the following in small amounts: silver, antimony, cobalt, copper, manganese and nickel. The resulting alloy has a melting and flowing temperature below 550.degree. F. and exhibits improved resistance to interface corrosion by virtue of an intermetallic compound layer formed at the interface.
Claims1
A solder alloy composition consisting, by weight, 5.0 to 65.0 percent bismuth, 0.05 to 95.0 percent lead, 0.05 to 55.0 percent cadmium, 0.05 to 10.0 percent silver, 0.05 to 15.0 percent antimony, 0.005 to 5.0 percent cobalt, 0.005 to 5.0 percent copper, 0.005 to 5.0 percent manganese and 0.005 to 5.0 percent nickel.
Dependencies are inferred from the claim text.