Solder alloys for soldering difficultly solderable material
AssigneeAsahi Glass Company, Limited
InventorsKoji Nomaki, Yoshihito Saoyama, Ryo Tamamura
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Abstract
Difficultly solderable materials having oxide surfaces such as glass, ceramics or metals such as Si, Ge, Al, Ti, Zr or Ta are soldered at a temperature lower than about 180.degree. C with a solder alloy composed of 2 - 98% by wt Pb, 1 - 97.5% by wt Sn, 0.5 - 60% Cd and 0.05 - 10% by wt Zn with the simultaneous application of vibration, preferably ultrasonic vibration.
Claims2
A solder alloy for soldering a difficultly solderable material having an oxide surface which consists essentially of 2-98 wt % Pb, 1-97.5 wt % Sn, 0.5-60 wt % Cd, 0.05-10 wt % Zn, 0.05-5 wt % Sb, 0-5 wt % Bi, and 0-15 wt % of at least one rare earth metal and which is characterized by a melting point of from 70.degree. to 180.degree. C.
A solder alloy for soldering a difficultly solderable material having an oxide surface which consists essentially of 20-40 wt % Pb, 40-60 wt % Sn, 5-25 wt % Cd, 1-5 wt % Zn, 0-3 wt % Bi, and 0.5-3 wt % Sb and which is characterized by a melting point of from 70.degree. to 180.degree. C.
Dependencies are inferred from the claim text.