B23K 35/268
Pb as the principal constituent
Official title: {Pb as the principal constituent}
B23K35/268 (Pb as the principal constituent) appears on 153 US grants and 100 published applications in this corpus.
Search patents in B23K- Granted patents
- 153
- Published applications
- 100
- Assignees
- 109
- Inventors
- 385
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 5 | 0 |
| 1995 | 1 | 0 |
| 1996 | 5 | 0 |
| 1997 | 9 | 0 |
| 1998 | 8 | 0 |
| 1999 | 4 | 0 |
| 2000 | 9 | 0 |
| 2001 | 7 | 1 |
| 2002 | 4 | 6 |
| 2003 | 7 | 5 |
| 2004 | 2 | 6 |
| 2005 | 3 | 6 |
| 2006 | 5 | 6 |
| 2007 | 3 | 7 |
| 2008 | 2 | 2 |
| 2009 | 5 | 6 |
| 2010 | 4 | 3 |
| 2011 | 3 | 5 |
| 2012 | 1 | 1 |
| 2013 | 4 | 2 |
| 2014 | 1 | 3 |
| 2015 | 2 | 7 |
| 2016 | 0 | 1 |
| 2017 | 7 | 9 |
| 2018 | 2 | 4 |
| 2019 | 4 | 1 |
| 2020 | 1 | 7 |
| 2021 | 2 | 3 |
| 2022 | 2 | 3 |
| 2023 | 4 | 3 |
| 2024 | 2 | 1 |
| 2025 | 3 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Passive quench protection techniques for non-insulated superconducting magnets4 Aug 2026US 12,700,530 B2Commonwealth Fusion Systems LLC
- Solder paste4 Nov 2025US 12,459,060 B2Senju Metal Industry Co., Ltd.
- Solder material and method for die attachment12 Aug 2025US 12,388,042 B2Alpha Assembly Solutions Inc.
- Barrier-type photovoltaic welding strip capable of reducing damp-heat attenuation15 Jul 2025US 12,364,026 B2Jinko Solar Co., Ltd.
- Co-production of lead and tin products13 Aug 2024US 12,060,626 B2Metallo Belgium
- Joining of lead and lead alloys27 Mar 2025US 2025/0100064 A1Lead Technologies, Inc.
- Conductive Compositions For Low Temperature Assembly Of Electronic Components9 Jan 2025US 2025/0010409 A1Ormet Circuits, Inc.
- Solder material and method for die attachment18 Jan 2024US 2024/0021565 A1Alpha Assembly Solutions Inc.
- Joining of lead and lead alloys17 Aug 2023US 2023/0256532 A1Lead Technologies, Inc.
- Passive quench protection techniques for non-insulated superconducting magnets11 May 2023US 2023/0146164 A1Commonwealth Fusion Systems LLC
Most cited
By later US patents
- Composite solder paste for flip chip bumping102US 5,803,340 ADelco Electronics Corporation · 1998
- Composite bearing structure of alternating hard and soft metal, and process for making the same92US 4,474,861 ASmith International, Inc. · 1984
- Method of manufacturing a leadframe having conductive elements preformed with solder bumps90US 5,066,614 AHoneywell Inc. · 1991
- Process for making an electrical interconnect structure73US 5,802,711 AInternational Business Machines Corporation · 1998
- Solder hierarchy for chip attachment to substrates66US 5,729,440 AInternational Business Machines Corporation · 1998