Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies
AssigneeTosoh SMD, Inc.
InventorsEugene Y. Ivanov, Tatyana F. Grigoriva, Vladimir V. Boldyrev
Life of this patent
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Abstract
Methods for facilitating recycling of backing plates in bonded target/backing plate assemblies and structural assemblies for use in these methods are disclosed. The target and backing plate are joined by a solder paste material that may be applied to adjoining surfaces of the target and backing plate at low temperature. The paste solidifies to have a high decomposition temperature on the order of greater than 400.degree. C. Provision of a solder layer having a liquidus temperature of about 100.degree.-250.degree. C. between the backing plate and solder paste allows for easy target and backing plate separation and subsequent backing plate reusage.
Claims29
Method of assembling and disassembling a sputter target and a backing plate comprising:
- (a) providing a sputter target having a first surface from which coating material is to be ejected to coat a desired substrate and a second surface adapted to mate with said backing plate;
- (b) providing a backing plate member having a top surface adapted to mate with said target along said target second surface;
- (c) applying a solder layer to said backing plate top surface;
- (d) placing a bonding material between said solder layer and said second surface of said target and joining said target and said backing plate;
- (e) heating said solder layer to its melting point;
- (f) separating said target from said backing plate;
- (g) providing another target;
- and
- (h) joining said other target to said backing plate.
Method of assembling a sputter target to a backing plate, comprising:
- (i) applying a solder material to a first surface of said backing plate, said first surface being adapted to bond to a surface of said sputter target;
- said solder material having a liquidus point of about 100.degree. to 250.degree. C.;
- (ii) applying a bonding material along a surface of said target and said first surface of said backing plate at a temperature of about ambient to 70.degree. C. and bonding said backing plate to said target;
- said bonding material having a decomposition temperature above said liquidus point of said solder material.
In a target and backing plate assembly of the type wherein said target and backing plate are joined together along interfacial surfaces by a metallic bonding material and wherein a solder material is disposed along the interfacial surface of said backing plate adjacent said metallic bonding material, a method for separating said target and backing plate so that said backing plate may be reused, said method comprising:
- heating said solder material to a temperature equal to or in excess of the liquidus temperature of said solder material;
- separating said target from said backing plate.
In a sputter target and backing plate combination wherein said sputter target and backing plate are bonded together along interfacial surfaces by a high decomposition temperature bonding material, the improvement comprising a thin solder layer of between about 1 to 1000 .mu.m located between said bonding material and said backing plate, said solder layer being composed of a solder material having a liquidus temperature below the decomposition temperature of said bonding material.
Dependencies are inferred from the claim text.