B23K 3/087
Soldering or brazing jigs, fixtures or clamping means
Official title: {Soldering or brazing jigs, fixtures or clamping means}
B23K3/087 (Soldering or brazing jigs, fixtures or clamping means) appears on 403 US grants and 391 published applications in this corpus.
Search patents in B23K- Granted patents
- 403
- Published applications
- 391
- Assignees
- 290
- Inventors
- 984
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 7 | 0 |
| 1988 | 7 | 0 |
| 1989 | 8 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 10 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 8 | 0 |
| 2000 | 13 | 0 |
| 2001 | 9 | 3 |
| 2002 | 4 | 2 |
| 2003 | 6 | 10 |
| 2004 | 6 | 9 |
| 2005 | 5 | 10 |
| 2006 | 4 | 10 |
| 2007 | 6 | 7 |
| 2008 | 6 | 9 |
| 2009 | 8 | 18 |
| 2010 | 6 | 13 |
| 2011 | 7 | 10 |
| 2012 | 16 | 15 |
| 2013 | 4 | 12 |
| 2014 | 8 | 11 |
| 2015 | 9 | 27 |
| 2016 | 15 | 20 |
| 2017 | 19 | 23 |
| 2018 | 16 | 18 |
| 2019 | 18 | 25 |
| 2020 | 17 | 27 |
| 2021 | 13 | 17 |
| 2022 | 24 | 18 |
| 2023 | 30 | 27 |
| 2024 | 17 | 19 |
| 2025 | 19 | 20 |
| 2026 | 8 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump6 Oct 2026US 12,752,360 B2Resonac Corporation
- Solder reflow apparatus and method of manufacturing an electronic device4 Aug 2026US 12,701,664 B2Samsung Electronics Co., Ltd.
- Substrate bonding apparatus21 Jul 2026US 12,690,482 B2Samsung Electronics Co., Ltd.
- Reflow method and system9 Jun 2026US 12,649,194 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus for soldering electronic devices2 Jun 2026US 12,643,168 B2Samsung Electronics Co., Ltd.
- Reflow jig designs and related methods13 Aug 2026US 2026/0233321 A1Semiconductor Components Industries, LLC
- Robot brazing system6 Aug 2026US 2026/0225228 A1Lincoln Global.Inc.
- Joining system and jig30 Jul 2026US 2026/0216808 A1Nippon Avionics Co., Ltd.
- Soldering leads to pads in producing basket catheter23 Jul 2026US 2026/0207884 A1Biosense Webster (Israel) Ltd.
- Laser compression bonding device7 May 2026US 2026/0124691 A1STATS ChipPAC Management Pte. Ltd.
Most cited
By later US patents
- Sockets for "springed" semiconductor devices115US 6,033,935 AFormFactor, Inc. · 2000
- Braze blocking insert for liquid phase brazing operation107US 5,935,718 AGeneral Electric Company · 1999
- Sockets for “springed” semiconductor devices91US 6,534,856 B1FormFactor, Inc. · 2003
- Sockets for “springed” semiconductor devices80US 6,232,149 B1FormFactor, Inc. · 2001
- Integrated electronics workstation73US 6,554,174 B12003