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US 6,232,149 B1Granted
Sockets for “springed” semiconductor devices
AssigneeFormFactor, Inc.
InventorsThomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen, Michael A. Stadt
Life of this patent
Estimating the term…
Abstract
Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
Claims2
An apparatus for effecting connections, the apparatus comprising:
- an electronic component,
- a plurality of elongate spring contact elements mounted to and extending from the electronic component, each spring contact element comprising an attachment region and a contact region, the contact region distant from the electronic component,
- an interconnection substrate, with a plurality of terminals adjacent a surface of the interconnection substrate;
- contact regions of at least a portion of the spring contact elements vertically in contact with selected ones of a corresponding plurality of terminals on the interconnection substrate;
- a planar member between the electronic component and the interconnection substrate;
- a plurality of guide holes in the planar member;
- and
- the contact regions of at least a portion of the spring contact elements extending through selected ones of the guide holes.
5 more elements
Dependencies are inferred from the claim text.