Substrate bonding apparatus

A substrate bonding apparatus, comprising:

• a first chuck having a diameter larger than that of a first substrate;
• a deformation plate configured to support the first substrate, and is configured to have a variable shape on the first chuck;
• a second chuck configured to support a second substrate opposite to the first substrate;
• a deformation unit between the first chuck and the deformation plate,
• wherein the deformation unit includes a main supporter that is deformable to press the deformation plate, the main supporter having a closed curve shape with a penetrating center, and
• wherein the second chuck comprises a first region and a second region alternately along an edge of the second substrate, and the second chuck vacuum-adsorbs the second substrate in the first region, and does not vacuum-adsorb the second substrate in the second region.

A substrate bonding apparatus comprising:

• a lower module comprising a first chuck having a diameter larger than that of a first substrate;
• and
• an upper module comprising a second chuck configured to support a second substrate opposite to the first substrate,
• wherein the lower module includes:
• a deformation plate configured to support the first substrate, the deformation plate above the first chuck and configured to have a variable shape, a thickness of an edge region of the deformation plate being thinner than a thickness of a center part or a middle region of the deformation plate, and a lower face of the edge region comprising an inclined face that is inclined upward relative to horizontal;
• a deformation unit between the first chuck and the deformation plate;
• a clamp unit configured to restrain the deformation plate to prevent the deformation plate from being detached from the first chuck;
• a cylindrical first rib with an open top at the center part of the deformation unit;
• a first sensor at the center part of the deformation unit and the first rib;
• and
• a first target at the center part on the lower face of the deformation plate and defining a sensing face of the first sensor,
• wherein the deformation unit includes:
• a main supporter having a ring shape and having an expandable volume in response to fluid supplied from a first fluid regulator to press the deformation plate;
• and
• an auxiliary support unit positioned outside the main supporter, the auxiliary support unit having a volume that is variable due to inflow and outflow of fluid supplied from a compressor, which presses the deformation plate in an upward direction by provision of a positive pressure, or which pulls the deformation plate in a downward direction by provision of a negative pressure by a vacuum pump,
• wherein the clamp unit includes:
• a first ring below the first chuck;
• a second ring above the deformation plate;
• and
• a bolt which is coupled to the first ring and the second ring, and passes through the deformation plate and the first chuck without being bolted to the deformation plate and the first chuck.