Laser compression bonding device

Abstract

A laser compression bonding device comprises: a carrier for placing a substrate; a transparent compression head for holding and displacing an electronic component, wherein the transparent compression head comprises a central portion for pressing the electronic component against the substrate via a solder material when the electronic component is placed on the substrate via the solder material, and a peripheral portion surrounding the central portion; a laser source for emitting a laser beam towards the carrier at least through the central portion of the transparent compression head to heat the solder material such that the electronic component is bonded onto the substrate via the solder material; and a heat spreader attached to the peripheral portion of the transparent compression head, wherein the heat spreader comprises a liquid channel for containing liquid that flows in the liquid channel to exchange heat with the transparent compression head.

Dependencies are inferred from the claim text.