Apparatus for soldering electronic devices

An apparatus for soldering electronic devices, the apparatus comprising:

• a base plate configured to support a package substrate, wherein a plurality of semiconductor chips are on the package substrate in a plurality of rows and a plurality of columns;
• a lamp heater configured to irradiate light to the plurality of semiconductor chips in a vertical direction, to mount the plurality of semiconductor chips on the package substrate;
• a pressurization mask including a transparent plate between the base plate and the lamp heater, wherein the transparent plate includes
• a first surface facing the base plate and a second surface opposite to the first surface, and
• a plurality of light absorbing patterns on a plurality of transmission regions of the first surface of the transparent plate, wherein the plurality of transmission regions at least partially overlap with corresponding semiconductor chips of the plurality of semiconductor chips in the vertical direction, the second surface of the transparent plate being free of the plurality of light absorbing patterns;
• and
• a mask holder secured to outer portions of the transparent plate, the mask holder configured to move the pressurization mask in the vertical direction to apply pressure to the plurality of semiconductor chips by contacting the plurality of light absorbing patterns with the plurality of semiconductor chips.

An apparatus for soldering electronic devices, the apparatus comprising:

• a base plate configured to support a package substrate, wherein a plurality of semiconductor chips are on the package substrate and a plurality of conductive connection members are on a lower surface of each semiconductor chip of the plurality of semiconductor chips;
• a lamp heater configured to irradiate light to the plurality of semiconductor chips in a vertical direction, to mount the plurality of semiconductor chips on the package substrate via separate, respective conductive connection members of the plurality of conductive connection members;
• a pressurization mask including a transparent plate between the base plate and the lamp heater, wherein the transparent plate includes
• a first surface facing the base plate and a second surface opposite to the first surface, and
• a light reflecting pattern on a reflection region of the second surface of the transparent plate, wherein the reflection region is not overlapped with the plurality of conductive connection members in the vertical direction;
• and
• a mask holder secured to outer portions of the transparent plate, the mask holder configured to move the pressurization mask in the vertical direction and press the corresponding semiconductor chips by contacting the pressurization mask with the corresponding semiconductor chips,
• wherein the transparent plate includes a plurality of transmission regions overlapped with the plurality of conductive connection members in the vertical direction, the plurality of transmission regions being on the first surface, and
• wherein the pressurization mask includes a plurality of light absorbing patterns on the plurality of transmission regions on the first surface, the second surface of the transparent plate being free of the plurality of light absorbing patterns.