B23K 3/0669
With dipping means
Official title: {with dipping means}
B23K3/0669 (With dipping means) appears on 141 US grants and 50 published applications in this corpus.
Search patents in B23K- Granted patents
- 141
- Published applications
- 50
- Assignees
- 94
- Inventors
- 221
- Latest grant
- 20 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 1 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 6 | 0 |
| 1986 | 8 | 0 |
| 1987 | 4 | 0 |
| 1988 | 6 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 6 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 0 |
| 2002 | 1 | 5 |
| 2003 | 4 | 1 |
| 2004 | 2 | 1 |
| 2005 | 2 | 5 |
| 2006 | 1 | 0 |
| 2007 | 2 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 3 | 2 |
| 2011 | 0 | 0 |
| 2012 | 1 | 1 |
| 2013 | 0 | 0 |
| 2014 | 3 | 5 |
| 2015 | 0 | 3 |
| 2016 | 3 | 4 |
| 2017 | 4 | 3 |
| 2018 | 5 | 2 |
| 2019 | 2 | 3 |
| 2020 | 1 | 5 |
| 2021 | 5 | 3 |
| 2022 | 2 | 1 |
| 2023 | 4 | 4 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wave solder finger detection system and method20 Jan 2026US 12,532,444 B1Illinois Tool Works Inc.
- Coating device and component mounting machine25 Mar 2025US 12,262,480 B2Fuji Corporation
- Systems and methods for providing an interface on a printed circuit board using pin solder enhancement22 Aug 2023US 11,731,207 B2Eagle Technology, LLC
- Systems and methods for providing an interface on a printed circuit board using pin solder enhancement14 Mar 2023US 11,602,800 B2Eagle Technology, LLC
- Zinc-cobalt barrier for interface in solder bond applications21 Feb 2023US 11,587,858 B2Texas Instruments Incorporated
- Multi-axis gripper unit of turntable type probe pin bonding apparatus30 Nov 2023US 2023/0381900 A1Laserssel Co., Ltd.
- Coating device and component mounting machine3 Aug 2023US 2023/0247772 A1Fuji Corporation
- Systems and methods for providing an interface on a printed circuit board using pin solder enhancement20 Apr 2023US 2023/0121381 A1Eagle Technology, LLC
- Method for selectively pretinning a guidewire core30 Mar 2023US 2023/0095943 A1Abbott Cardiovascular System Inc.
- Bonding device and method in microcomponent process and welding-agent placing unit10 Feb 2022US 2022/0045252 A1Chongqing Konka Photoelectric Technology Research Institute Co., Ltd.
Most cited
By later US patents
- Solder ball placement apparatus45US 6,056,190 ASpeedline Technologies, Inc. · 2000
- Apparatus for holding printed circuit boards during wave soldering and processing39US 5,067,648 ALockheed Sanders, Inc. · 1991
- Apparatus for applying solder to printed circuit boards30US 4,408,560 ASinter Limited · 1983
- Adjustable printed circuit board pallet24US 4,030,717 AD.N.S. Precision Machining · 1977
- Printed circuits board soldering apparatus23US 5,038,706 ATeledyne Industries, Inc. · 1991